Hierarchical patterning for fabrication of advanced structures for few nm node devices and photonics using block copolymer lithography
Activity: Talk or presentation › Invited lecture
Sozaraj Rasappa - Speaker
Block copolymer (BCP) lithography is a promising candidate for wafer scale patterning. However, BCP lithography is not an alternative to traditional lithography on its own but serves as a complimentary patterning technique. Thin films of self-assembled architectures of BCPs have been investigated to generate various specific device structures. The BCPs that are most commonly used are based on polystyrene as one of the blocks, covalently coupled with polyethylene oxide, polymethylmethacrylate,polylactic acid, polyvinylpyridine or polydimethylsiloxane (PS-b-PEO, PS-b-PMMA, PS-b-PLA, PS-b-PVP or PS-b-PDMS) as the other block. BCPs have versatile applications depending on their molecular weight and characteristic properties. As examples of our work with BCPs we present low molecular weight BCP as a patterning precursor for fabrication of sub-10 nm FinFETs, sub-10 nm 2D materials and optical nanofin structures. Alternatively, larger structures by high molecular weight BCPs can be effectively used for fabrication of hard mask, antireflection, metal and III-V nanostructures.
External organisation (University)
|Name||Lund University, Faculty of Engineering|