Tampere University of Technology

TUTCRIS Research Portal

Department of Electronics and Communications Engineering

Research unit: Department

  1. Published

    The internet of Bio-Nano things

    Akyildiz, I. F., Pierobon, M., Balasubramaniam, S. & Koucheryavy, Y., 1 Mar 2015, In : IEEE Communications Magazine. 53, 3, p. 32-40 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  2. Published

    Human Body Effects on Inkjet-Printed Flexible RF Interconnections

    Alam, S., Sillanpää, H. P. & Mäkinen, R. M., 2013, In : Progress in Electromagnetics Research C. 35, p. 83-94

    Research output: Contribution to journalArticleScientificpeer-review

  3. Published

    Age‐related circulatory responses to whole body cooling: observations by heart rate variability

    Alametsä, J., Kuklane, K., Smolander, J., Vanggaard, L., Halder, A., Lundgren, K., Gao, C. & Viik, J., 11 May 2015, In : Finnish Journal of eHealth and eWelfare. 7, 2-3, p. 57-64

    Research output: Contribution to journalArticleScientificpeer-review

  4. Published

    Local Ballistocardiographic Spectrum Studies from Signals Obtained from Limbs and Carotid Artery with an EMFi Sensor Induced with a Tilt Table

    Alametsä, J., Palomäki, A. & Viik, J., 2013, EMBC 2013, 35th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBS) , 3-7 July 2013, Osaka, Japan. p. 7008-7011 4 p. (Annual International Conference of the IEEE Engineering in Medicine and Biology Society).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  5. Published

    Analysis of Substrates for Single Emitter Laser Diodes

    Alander, T., Heino, P. & Ristolainen, E., 2003, In : Journal of Electronic Packaging. 125, p. 313-317

    Research output: Contribution to journalArticleScientificpeer-review

  6. Published

    Puolijohdelaserien liittäminen

    Alander, T., 2000, Elektroniikan valmistus 2000, Elektroniikan tuotanto- ja pakkaustekniikan konferenssi Porissa 18.-19.5.2000, Julkaisusarja A - Porin korkeakouluyksikkö. Pori, p. 139-143

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  7. Published

    Solder bump reliability - Issues on bump layout

    Alander, T., Heino, P. & Ristolainen, E., 2000, In : IEEE Transactions on Aerospace and Electronic Systems. 23, 4, p. 715-720

    Research output: Contribution to journalArticleScientificpeer-review

  8. Published

    Improving the fatigue life of a bare die flip chip by thinning

    Alander, T., Suominen, I., Heino, P. & Ristolainen, E., 2003, In : Soldering and Surface Mount Technology. 15, 3, p. s. 14

    Research output: Contribution to journalArticleScientificpeer-review

  9. Published

    Impact of component placement in solder joint reliability

    Alander, T., Nurmi, S., Heino, P. & Ristolainen, E., 2002, In : Microelectronics Reliability. 42, p. 399-406

    Research output: Contribution to journalArticleScientificpeer-review

  10. Published

    Analysis of Laser Bar Bonding Reliability on Different Substrates

    Alander, T., Heino, P. & Ristolainen, E., 2001, In : International Journal of Microcircuits & Electronic Packaging. 24, 2, p. 160-172

    Research output: Contribution to journalArticleScientificpeer-review

Previous 1...4 5 6 7 8 9 10 11 ...353 Next

ID: 22326