Tampere University of Technology

TUTCRIS Research Portal

Department of Electronics and Communications Engineering

Research unit: Department

  1. Published

    Review article: Homology in electromagnetic boundary value problems

    Pellikka, M., Suuriniemi, S. & Kettunen, L., 2010, In : Boundary Value Problems. 2010, p. 1-18 18 p., 381953.

    Research output: Contribution to journalReview ArticleScientificpeer-review

  2. Published

    Response patterns in finger and central body skin temperatures under mild whole body cooling in an elderly and in a young male - a pre-study

    Kuklane, K., Vanggaard, L., Smolander, J., Halder, A., Lundgren, K., Gao, C., Viik, J. & Alametsä, J., 14 Sep 2015, In : Extreme Physiology & Medicine. 4, Suppl 1, A32.

    Research output: Contribution to journalMeeting AbstractScientificpeer-review

  3. Published

    Response Analysis of Second-Order Multi-Band Quadrature Modulators with Applications in Cognitive Radio Devices

    Marttila, J., Allen, M. & Valkama, M., 2011, The 54th IEEE International Midwest Symposium on Circuits and Systems, IEEE MWSCAS 2011, August 7-10, 2011, Seoul, Korea. Piscataway, NJ: IEEE, p. 1-4 4 p. (IEEE International Midwest Symposium on Circuits and Systems MWSCAS).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  4. Published

    Response

    Korpinen, L., Kuisti, H., Elovaara, J. & Virtanen, V., 2013, In : PACE: Pacing and Clinical Electrophysiology. 36, 2, p. 267-268 2 p.

    Research output: Contribution to journalArticleScientific

  5. Published

    Resource Management Schemes for Network Assisted Device-to-Device Communication for an Integrated OFDMA Cellular System

    Xing, H. & Renfors, M., 2015, 2015 IEEE 26th International Symposium on Personal, Indoor and Mobile Radio Communications - (PIMRC): Mobile and Wireless Networks. IEEE, p. 1520-1525 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  6. Published

    Resistance measurements in conductive fabrics

    Pola, T. & Vanhala, J., 2011, 2011 International Conference on Advanced Material Research, ICAMR 2011, January 21 - January 23, 2011, Chongqing, China. Advanced Materials Research. Zhang, Y. (ed.). Switzerland: Trans Tech Publications, p. 121-125 (International Conference on Advanced Material Research ICAMR; vol. 213).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  7. Published

    Residual Stresses in Plastic Random Systems

    Alava, M. J., Karttunen, M. E. J. & Niskanen, K. J., 1995, In : Europhysics Letters. 2, 32, p. 143-148

    Research output: Contribution to journalArticleScientificpeer-review

  8. Published

    Research on stability of magnesium diboride superconductors. Stability studies on conductors and coils.

    Stenvall, A., 2009, Saarbrucken: VDM VERLAG DR. MÜLLER. 96 p.

    Research output: Book/ReportBookScientificpeer-review

  9. Published

    Research on audio-video synchronization coding based on mode selection in H.264

    Li, X. & Wang, D., 2012, 2012 International Applied Mechanics, Mechatronics Automation Symposium, IAMMAS 2012, 7-9 September 2012, Shenyang, Liaoning; China. Trans Tech Publications, p. 701-705 5 p. (Applied Mechanics and Materials; vol. 182-183).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  10. Published

    Replacing terrestrial UMTS coverage by HAP in disaster scenarios

    Lähdekorpi, P., Isotalo, T., Kylä-Liuhala, K. & Lempiäinen, J., 2010, Proceedings of EW2010, European Wireless 2010, April 12-15, 2010, Lucca, Italy. p. 14-19

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  11. Published

    Remote management of intelligent devices: Using TR-069 protocol in IoT

    Stusek, M., Masek, P., Kovac, D., Ometov, A., Hosek, J., Kropfl, F. & Andreev, S., 1 Dec 2016, 2016 39th International Conference on Telecommunications and Signal Processing (TSP). IEEE, p. 74-78

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  12. Published

    Remotely Powered Piezoresistive Pressure Sensor: Toward Wireless Monitoring of Intracranial Pressure

    Khan, M. W. A., Björninen, T., Sydänheimo, L. & Ukkonen, L., 2016, In : IEEE Microwave and Wireless Components Letters. 26, 7, p. 549-551

    Research output: Contribution to journalArticleScientificpeer-review

  13. Published

    Reliable mobile computing to underground mine

    Sydänheimo, L., Keskilammi, M. & Kivikoski, M., 2000, Conference Record, International Conference on Communications, ICC 2000, June 18-22, 2000, New Orleans, USA. p. 882-888

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  14. Published

    Reliability testing of frequency converters with salt spray and temperature humidity tests

    Kiilunen, J. & Frisk, L., 2009, EMPC2009, 17th European Microelectronics and Packaging Conference & Exhibition, June 15 - 18, 2009, Rimini, Italy. p. 5 p

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  15. Published

    Reliability study of flexible inkjet- and thermal-printed RFID antennas in high humidity conditions

    Rizwan, M., Adhur Kutty, A., Kgwadi, M., Drysdale, T. D., Ukkonen, L. & Virkki, J., 11 Apr 2016, 2016 10th European Conference on Antennas and Propagation (EuCAP). IEEE

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  16. Published

    Reliability Study of 3-D Stacked Structures

    Heikkilä, R., Tanskanen, J. & Ristolainen, E. O., 2002, ECTC2002 The 52nd Electronic Components and Technology Conference, May 28-31, 2002, Sheraton San Diego, Hotel & Marina, San Diego, California, USA. p. 5 s

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  17. Published

    Reliability optimization of stacked system-in-package using FEA

    Valtanen, J. & Heino, P., 2006, 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Eurosime 2006, April 24-26, 2006, Como, Italy. Ernst, L. J. (ed.). p. 313-317

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  18. Published

    Reliability of WSN Hardware

    Virkki, J., Zhu, Y., Meng, Y. & Chen, L., 2011, In : International Journal of Embedded Systems and Applications. 1, 2

    Research output: Contribution to journalArticleScientificpeer-review

  19. Published

    Reliability of washable wearable screen printed UHF RFID tags

    Virkki, J., Björninen, T., Kellomäki, T., Merilampi, S., Shafiq, I., Ukkonen, L., Sydänheimo, L. & Chan, Y. C., 2014, In : Microelectronics Reliability. 54, 4, p. 840-846 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  20. Published

    Reliability of unencapsulated SMD plastic film capasitors

    Seppälä, A., Saarinen, K. & Ristolainen, E., 2000, In : Soldering and Surface Mount Technology. 12, 1, p. 15-22

    Research output: Contribution to journalArticleScientificpeer-review

  21. Published

    Reliability of UHF RFID tags in humid environments

    Saarinen, K. & Frisk, L., 2012, 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012, 5-7 December, Singapore. p. 180-184 5 p. (Electronics Packaging Technology Conference).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  22. Published

    Reliability of tin-lead balled BGAs soldered with lead-free solder paste

    Nurmi, S. & Ristolainen, E., 2002, In : Soldering and Surface Mount Technology. 14, 2, p. 35-39

    Research output: Contribution to journalArticleScientificpeer-review

  23. Published

    Reliability of the TileTrack Capacitive User Tracking System in Smart Home Environment

    Kivimäki, T., Vuorela, T., Valtonen, M. & Vanhala, J., 2013, 2013 20th International Conference on Telecommunications (ICT), May 6-8, 2013, Casablanca, Morocco. 5 p. (International Conference on Telecommunications).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  24. Published

    Reliability of SnAgCu Solder Joints Under Thermo-Mechanical Stresses

    Nurmi, S., 14 Jan 2005, Tampere University of Technology. 45 p. (Tampere University of Technology. Publication; vol. 520)

    Research output: Book/ReportDoctoral thesisCollection of Articles

  25. Published

    Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors

    Putaala, J., Hannu, J., Kunnari, E., Mäntysalo, M., Nousiainen, O. & Jantunen, H., 2014, In : Microelectronics Reliability. 54, 1, p. 272-280 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  26. Published

    Reliability of Passive UHF RFID Copper Tags on Plywood Substrate in High Humidity Conditions

    Sipilä, E., Virkki, J., Sydänheimo, L. & Ukkonen, L., 5 Jun 2016, The IMAPS Nordic Annual Conference Proceedings. IMAPS Nordic, p. 12-16 5 p. (Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  27. Published

    Reliability of passive RFID of multiple objects using folded microstrip patch-type tag antenna

    Ukkonen, L., Engels, D., Sydänheimo, L. & Kivikoski, M., 2005, 2005 IEEE Antennas and Propagation Society International Symposium and USNC/URSI National Radio Science Meeting, July 3-8, 2005, Washington, DC, USA. p. 337-345

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  28. Published

    Reliability of multi-path virus nanonetworks

    Walsh, F. & Balasubramaniam, S., 2013, 2013 IEEE International Conference on Communications Workshops, ICC 2013, Budapest, Hungary, 9.-13.6.2013. Institute of Electrical and Electronics Engineers IEEE, p. 824-828 5 p. (IEEE International Conference on Communications).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  29. Published

    Reliability of Interconnections in Inkjet Printed Electronics

    Niittynen, J., Halonen, E., Putaala, J., Hannu, J., Jantunen, H. & Mäntysalo, M., 2013, Printing Future Days 2013, September 6th - 9th, 2013, Chemnitz, Germany. Berlin, Germany: Verlag für Wissenschaft und Bildung VWB, p. 19-24 6 p. (Printing Future Days).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  30. Published

    Reliability of ICA passive component attachments under humid conditions

    Frisk, L., Lahokallio, S., Kiilunen, J. & Saarinen, K., 2012, Proceedings of the IMAPS Nordic Annual Conrefence, September 2-4, 2012, Helsingør, Denmark. Jarkko, K. (ed.). Mölndal, Sweden: International Microelectronics and Packaging Society, Nordic, p. 140-145 (International Microelectronics and Packaging Society Nordic Annual Conference).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  31. Published

    Reliability of ICA attachment of SMDs on inkjet-printed substrates

    Niittynen, J., Kiilunen, J., Putaala, J., Pekkanen, V., Mäntysalo, M., Jantunen, H. & Lupo, D., 2012, In : Microelectronics Reliability. 52, 11, p. 2709-2715

    Research output: Contribution to journalArticleScientificpeer-review

  32. Published

    Reliability of high density flip chip on flex interconnection

    Palm, P., Määttänen, J., Tuominen, A. & Ristolainen, E., 2000, IMAPS - Europe Prague 2000, June 18-20, 2000, Prague, Czech Republic. p. 111-115 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  33. Published

    Reliability of Flex-to-Flex Interconnections on Inkjet-Printed PCBs Using Electrically Conductive Adhesives

    Niittynen, J., Koskinen, S., Mäntysalo, M., Kiilunen, J., Pippola, J. & Frisk, L., 2014, SMTA Pan Pacific Microelectronics Symposium, February 11-13, 2014, Hawaii, USA. Edina, Minnesota: Surface Mount Technology Association, p. 1-8 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  34. Published

    Reliability of anisotropic conductive adhesive bonded flip chip joints on organic substrates

    Frisk, L., 2007, Tampere: Tampere University of Technology. (Tampereen teknillinen yliopisto. Julkaisu; vol. 673)

    Research output: Book/ReportDoctoral thesisCollection of Articles

  35. Published

    Reliability of adhesive attachments on thick film hybrid substrate

    Kiilunen, J., Kuusiluoma, S. & Heino, P., 2007, Proceedings of the 2007 9th Electronics Packaging Technology Conference, 10-12 December 2007, Singapore. p. 764-769

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  36. Published

    Reliability of ACF Interconnections on FR-4 Substrates

    Frisk, L., Saarinen, K. & Cumini, A., 2011, In : IEEE Transactions on Components and Packaging Technologies. 33, 1, p. 138-147

    Research output: Contribution to journalArticleScientificpeer-review

  37. Published

    Reliability of ACF flip chip joint on flexible substrate

    Jokinen, E., Seppälä, A., Pienimaa, S. & Ristolainen, E., 2000, Proceedings, The 37th IMAPS Nordic Annual Conference, Hotel Marienlyst, Helsingor, Denmark, 10-13 September 2000. p. 192-196

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  38. Published

    Reliability of ACA Joints with Conformal Coatings in Harsh Environments

    Kokko, K., 2010, Tampere: Tampere University of Technology. (Tampereen teknillinen yliopisto. Julkaisu; vol. 913)

    Research output: Book/ReportDoctoral thesisCollection of Articles

  39. Published

    Reliability of ACA joined thinned chips on rigid substrates under humid conditions

    Frisk, L., Saarinen, K. & Kokko, K., 2011, EMPC-2011 18th European Microelectronics & Packaging Conference, 12th-15th September 2011, Brighton, UK. Piscataway, NJ: IEEE, p. 1-7 7 p. (European Microelectronics & Packaging Conference EMPC).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  40. Published

    Reliability of ACA bonded flip chip joints on LCP and PI substrates

    Frisk, L. & Cumini, A., 2006, In : Soldering and Surface Mount Technology. 18, 4, p. 12-20

    Research output: Contribution to journalArticleScientificpeer-review

  41. Published

    Reliability of ACA bonded flip chip joints on LCP and FR-4 substrates

    Frisk, L. & Cumini, A., 2007, EMPC 2007. The 16th European Microelectronics and Packaging Conference & Exhibition, June 17-20, 2007, Oulu, Finland. p. 478-483

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  42. Published

    Reliability of 80 qm pitch flip chip attachment on flex

    Palm, P., Määttänen, J., Tuominen, A. & Ristolainen, E., 2001, In : Microelectronics Reliability. 41, p. 633-638

    Research output: Contribution to journalArticleScientificpeer-review

  43. Published

    Reliability Issues of Flip Chip Joining Using No-Flow Underfills

    Aalto, K. & Ristolainen, E., 2003, 14th European Microelectronics and Packaging Conference & Exhibition, June 23-25, 2003, Graf-Zeppelin-Haus, Lake Constance, Friedrichshafen, Germany. p. 303-307

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  44. Published

    Reliability Evaluation Structures for Stacked Thin Dice Packaging

    Karjalainen, P., Tanskanen, J. & Ristolainen, E., 2003, Proceedings of Fifty-Third Electronic Components & Technology Conference, May 27-30, 2003, New Orleans, Louisiana, USA. p. 1197-1202

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  45. Published

    Reliability Evaluation of 3D-Package with Specific Test Structures

    Tanskanen, J., Alander, T. & Ristolainen, E. O., 2002, ECTC2002 The 52nd Electronic Components and Technology Conference, May 28-31, 2002, Sheraton San Diego, Hotel & Marina, San Diego, California, USA. p. 5 s

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  46. Published

    Reliability Enhancement of ACF Joined Flip Chips with Parylene C as a Protective Coating

    Kokko, K. H., Mostofizadeh, M. & Lupo, D. W., 2013, Proceedings of the IASTED International Conference Biomedical Engineering, BioMed 2013, February 13-15, 2013 Innsbruck, Austria. p. 265-270 6 p. (IASTED International Conference on Biomedical Engineering).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  47. Published

    Reliability assessment of flip chip attachments on thick film hybrid substrate using ACF and NCF adhesives

    Kiilunen, J., Kuusiluoma, S. & Heino, P., 2006, The IMAPS Nordic Annual Conference, September 17-19, 2006, Gothenburg, Sweden. p. 179-183

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  48. Published

    Reliability and usability in data transmission networks of the AMR system: a pilot study

    Oksa, P., Soini, M., Nummela, J., Sydänheimo, L. & Kivikoski, M., 2006, 4th WSEAS Interantional Conference on Information Security, Communications and Computers, Tenerife, Spain, December 16-16, 2005. p. 388-393

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  49. Published

    Reliability and scalability of the Kilavi building control platform

    Soini, M. N. K., Sydänheimo, L. T. & Kivikoski, M. A., 2007, ISCE 2007, the 11th Annual IEEE International Symposium of Consumer Electronics, Irwing, Texas, USA, 20-22 June 2007. p. 6 p

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  50. Published

    Reliability and Microstructural Studies of Sn-Ag-Cu Lead-Free Solder Joints in Pulse-Heated Reflow Soldering

    Mostofizadeh, M., Kokko, K. & Frisk, L., 2012, IEEE 62nd Electronic Components & Technology Conference ECTC 2012, May 29 - June 1, 2012, San Diego, California, USA. Piscataway, NJ: Institute of Electrical and Electronics Engineers IEEE, p. 2613-2170 (Electronic Components and Technology Conference).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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