Tampere University of Technology

TUTCRIS Research Portal

Research area: Reliability

Research unit: Research Area

  1. 2017
  2. Published

    Performance and Reliability of Polymer-based Sensor Packages at High Temperatures

    Lahokallio, S., 9 Jun 2017, Tampere University of Technology. 93 p. (Tampere University of Technology. Publication; vol. 1475)

    Research output: Book/ReportDoctoral thesisCollection of Articles

  3. 2016
  4. Published

    High density R2R Screen Printed Silver Interconnections for Hybrid System Integration

    Kraft, T., Leppänen, L., Kololuoma, T., Lahokallio, S., Frisk, L. & Mäntysalo, M., 5 Dec 2016, 6th Electronic System-Integration Technology Conference (ESTC). IEEE, 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  5. Published

    Multivariable accelerated testing of seep through of humidity due to vibration in electric connector

    Ojala, P., Pippola, J., Hietala, J-P., Miettinen, J., Frisk, L., Julkunen, P. & Varpe, E-L., 26 Oct 2016, Risk, Reliability and Safety: Innovating Theory and Practice: Proceedings of the 26th European, Safety and Reliability Conference, ESREL 2016, Glasgow, Scotland, 25-29 September 2016. Walls, L., Revie, M. & Bedford, T. (eds.). CRC Press, 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  6. Published

    Effect of Epoxy Flux Underfill on Thermal Cycling Reliability of Sn-8Zn-3Bi Lead-Free Solder in a Sensor Application

    Mostofizadeh, M., Najari, M., Das, D., Pecht, M. & Frisk, L., 16 Aug 2016, Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. IEEE, p. 2169-2175 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  7. Published

    Reliability of ACA interconnections on microvia HDI PCBs in thermal cycling conditions

    Frisk, L., Lahokallio, S. & Kiilunen, J., 5 Jun 2016, IMAPS Nordic Annual Conference 2016 Proceedings. Kutilainen, J. (ed.). IMAPS-International Microelectronics and Packaging Society

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  8. Published

    Corrosion testing of anisotropic conductive adhesive interconnections on FR4, liquid crystal polymer and polyimide substrates

    Parviainen, A., Kokko, K. & Frisk, L., 12 Jan 2016, In : Microelectronics Reliability. 56, p. 114-120 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  9. Published

    Effects of different anisotropically conductive adhesives on the reliability of UHF RFID tags

    Saarinen-Pulli, K., Lahokallio, S. & Frisk, L., 2016, In : International Journal of Adhesion and Adhesives. 64, p. 52-59 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  10. Published

    Performance of Anisotropically Conductive Adhesive Attachments on Adhesiveless Polyimide Substrate during High-Temperature Storage Tests

    Lahokallio, S. & Frisk, L., 2016, In : MRS Advances. 1, 51, p. 3459-3464 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  11. Published

    Performance of a Polymer-Based Sensor Package at Extreme Temperature

    Lahokallio, S., Hoikkanen, M., Marttila, T., Vuorinen, J., Kiilunen, J. & Frisk, L., 2016, In : Journal of Electronic Materials. 45, 2, p. 1184-1200 17 p.

    Research output: Contribution to journalArticleScientificpeer-review

  12. Published

    Reliability of Anisotropic Conductive Adhesive Flip Chip Attached Humidity Sensors in Prolonged Hygrothermal Exposure

    Frisk, L., Lahokallio, S., Mostofizadeh, M., Parviainen, A. & Kiilunen, J., 2016, In : Procedia Engineering. 168, p. 1763-1766 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

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