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13.5 A 0.35-to-2.6GHz multilevel outphasing transmitter with a digital interpolating phase modulator enabling up to 400MHz instantaneous bandwidth

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Standard

13.5 A 0.35-to-2.6GHz multilevel outphasing transmitter with a digital interpolating phase modulator enabling up to 400MHz instantaneous bandwidth. / Kosunen, Marko; Lemberg, Jerry; Martelius, Mikko; Roverato, Enrico; Nieminen, Tero; Englund, Mikko; Stadius, Kari; Anttila, Lauri; Pallonen, Jorma; Valkama, Mikko; Ryynänen, Jussi.

2017 IEEE International Solid-State Circuits Conference, ISSCC 2017. IEEE, 2017. p. 224-225.

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Harvard

Kosunen, M, Lemberg, J, Martelius, M, Roverato, E, Nieminen, T, Englund, M, Stadius, K, Anttila, L, Pallonen, J, Valkama, M & Ryynänen, J 2017, 13.5 A 0.35-to-2.6GHz multilevel outphasing transmitter with a digital interpolating phase modulator enabling up to 400MHz instantaneous bandwidth. in 2017 IEEE International Solid-State Circuits Conference, ISSCC 2017. IEEE, pp. 224-225, IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE, 1/01/00. https://doi.org/10.1109/ISSCC.2017.7870342

APA

Kosunen, M., Lemberg, J., Martelius, M., Roverato, E., Nieminen, T., Englund, M., ... Ryynänen, J. (2017). 13.5 A 0.35-to-2.6GHz multilevel outphasing transmitter with a digital interpolating phase modulator enabling up to 400MHz instantaneous bandwidth. In 2017 IEEE International Solid-State Circuits Conference, ISSCC 2017 (pp. 224-225). IEEE. https://doi.org/10.1109/ISSCC.2017.7870342

Vancouver

Kosunen M, Lemberg J, Martelius M, Roverato E, Nieminen T, Englund M et al. 13.5 A 0.35-to-2.6GHz multilevel outphasing transmitter with a digital interpolating phase modulator enabling up to 400MHz instantaneous bandwidth. In 2017 IEEE International Solid-State Circuits Conference, ISSCC 2017. IEEE. 2017. p. 224-225 https://doi.org/10.1109/ISSCC.2017.7870342

Author

Kosunen, Marko ; Lemberg, Jerry ; Martelius, Mikko ; Roverato, Enrico ; Nieminen, Tero ; Englund, Mikko ; Stadius, Kari ; Anttila, Lauri ; Pallonen, Jorma ; Valkama, Mikko ; Ryynänen, Jussi. / 13.5 A 0.35-to-2.6GHz multilevel outphasing transmitter with a digital interpolating phase modulator enabling up to 400MHz instantaneous bandwidth. 2017 IEEE International Solid-State Circuits Conference, ISSCC 2017. IEEE, 2017. pp. 224-225

Bibtex - Download

@inproceedings{201ca36f4a29450ab6bf0b3004b2c450,
title = "13.5 A 0.35-to-2.6GHz multilevel outphasing transmitter with a digital interpolating phase modulator enabling up to 400MHz instantaneous bandwidth",
abstract = "Advanced wireless radio standards set stringent requirements on the bandwidth, frequency range and reconfigurability of base-station transmitters. Recently, the outphasing concept has shown promise of wide bandwidth while taking advantage of process scaling with extensive exploitation of rail-to-rail signaling. Recent outphasing transmitter designs have often focused on power-amplifier (PA) and power-combiner implementations while omitting the phase modulator [1,2]. Moreover, previously reported transmitters with integrated digital phase modulators have only shown bandwidths up to 40MHz [3,4], although 133MHz has been demonstrated at 10GHz carrier frequency utilizing phase modulators based on conventional IQ-DACs [5]. Thus, digital-intensive outphasing transmitters capable of modulation with hundreds of MHz bandwidth at existing cellular frequency bands have not yet been published. To address the aforementioned challenge, this paper introduces a multilevel outphasing transmitter with four amplitude levels, including the first prototype implementation based on the digital interpolating phase modulator concept [6]. The transmitter is targeted for 5G picocell base stations and has been verified to operate with instantaneous bandwidth up to 400MHz. In addition, the developed phase modulator eliminates the need for complex on-chip frequency synthesizers by introducing digital carrier frequency generation, demonstrated between 0.35 and 2.6GHz, while utilizing a single 1.8GHz reference clock.",
author = "Marko Kosunen and Jerry Lemberg and Mikko Martelius and Enrico Roverato and Tero Nieminen and Mikko Englund and Kari Stadius and Lauri Anttila and Jorma Pallonen and Mikko Valkama and Jussi Ryyn{\"a}nen",
year = "2017",
month = "3",
day = "2",
doi = "10.1109/ISSCC.2017.7870342",
language = "English",
publisher = "IEEE",
pages = "224--225",
booktitle = "2017 IEEE International Solid-State Circuits Conference, ISSCC 2017",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - 13.5 A 0.35-to-2.6GHz multilevel outphasing transmitter with a digital interpolating phase modulator enabling up to 400MHz instantaneous bandwidth

AU - Kosunen, Marko

AU - Lemberg, Jerry

AU - Martelius, Mikko

AU - Roverato, Enrico

AU - Nieminen, Tero

AU - Englund, Mikko

AU - Stadius, Kari

AU - Anttila, Lauri

AU - Pallonen, Jorma

AU - Valkama, Mikko

AU - Ryynänen, Jussi

PY - 2017/3/2

Y1 - 2017/3/2

N2 - Advanced wireless radio standards set stringent requirements on the bandwidth, frequency range and reconfigurability of base-station transmitters. Recently, the outphasing concept has shown promise of wide bandwidth while taking advantage of process scaling with extensive exploitation of rail-to-rail signaling. Recent outphasing transmitter designs have often focused on power-amplifier (PA) and power-combiner implementations while omitting the phase modulator [1,2]. Moreover, previously reported transmitters with integrated digital phase modulators have only shown bandwidths up to 40MHz [3,4], although 133MHz has been demonstrated at 10GHz carrier frequency utilizing phase modulators based on conventional IQ-DACs [5]. Thus, digital-intensive outphasing transmitters capable of modulation with hundreds of MHz bandwidth at existing cellular frequency bands have not yet been published. To address the aforementioned challenge, this paper introduces a multilevel outphasing transmitter with four amplitude levels, including the first prototype implementation based on the digital interpolating phase modulator concept [6]. The transmitter is targeted for 5G picocell base stations and has been verified to operate with instantaneous bandwidth up to 400MHz. In addition, the developed phase modulator eliminates the need for complex on-chip frequency synthesizers by introducing digital carrier frequency generation, demonstrated between 0.35 and 2.6GHz, while utilizing a single 1.8GHz reference clock.

AB - Advanced wireless radio standards set stringent requirements on the bandwidth, frequency range and reconfigurability of base-station transmitters. Recently, the outphasing concept has shown promise of wide bandwidth while taking advantage of process scaling with extensive exploitation of rail-to-rail signaling. Recent outphasing transmitter designs have often focused on power-amplifier (PA) and power-combiner implementations while omitting the phase modulator [1,2]. Moreover, previously reported transmitters with integrated digital phase modulators have only shown bandwidths up to 40MHz [3,4], although 133MHz has been demonstrated at 10GHz carrier frequency utilizing phase modulators based on conventional IQ-DACs [5]. Thus, digital-intensive outphasing transmitters capable of modulation with hundreds of MHz bandwidth at existing cellular frequency bands have not yet been published. To address the aforementioned challenge, this paper introduces a multilevel outphasing transmitter with four amplitude levels, including the first prototype implementation based on the digital interpolating phase modulator concept [6]. The transmitter is targeted for 5G picocell base stations and has been verified to operate with instantaneous bandwidth up to 400MHz. In addition, the developed phase modulator eliminates the need for complex on-chip frequency synthesizers by introducing digital carrier frequency generation, demonstrated between 0.35 and 2.6GHz, while utilizing a single 1.8GHz reference clock.

U2 - 10.1109/ISSCC.2017.7870342

DO - 10.1109/ISSCC.2017.7870342

M3 - Conference contribution

SP - 224

EP - 225

BT - 2017 IEEE International Solid-State Circuits Conference, ISSCC 2017

PB - IEEE

ER -