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3D integration of electronics and mechanics

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3D integration of electronics and mechanics. / Peltola, T; Mansikkamaki, P; Ristolainen, EO.

2005 IEEE/CPMT 10th International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces. March 16-18, 2005, Irvine, CA, USA. IEEE, 2005. p. 5-8.

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Harvard

Peltola, T, Mansikkamaki, P & Ristolainen, EO 2005, 3D integration of electronics and mechanics. in 2005 IEEE/CPMT 10th International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces. March 16-18, 2005, Irvine, CA, USA. IEEE, pp. 5-8, 10th International Symposium on Advanced Packaging Materials, Canada, 16/03/05.

APA

Peltola, T., Mansikkamaki, P., & Ristolainen, EO. (2005). 3D integration of electronics and mechanics. In 2005 IEEE/CPMT 10th International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces. March 16-18, 2005, Irvine, CA, USA (pp. 5-8). IEEE.

Vancouver

Peltola T, Mansikkamaki P, Ristolainen EO. 3D integration of electronics and mechanics. In 2005 IEEE/CPMT 10th International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces. March 16-18, 2005, Irvine, CA, USA. IEEE. 2005. p. 5-8

Author

Peltola, T ; Mansikkamaki, P ; Ristolainen, EO. / 3D integration of electronics and mechanics. 2005 IEEE/CPMT 10th International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces. March 16-18, 2005, Irvine, CA, USA. IEEE, 2005. pp. 5-8

Bibtex - Download

@inproceedings{d394d9043e9c47e2a23572be3ee70817,
title = "3D integration of electronics and mechanics",
abstract = "Nowadays, the design is one of the key features for all consumer products. All the novel functions must be available inside fashionable covers. However, the most interesting product shapes are not always possible due the restriction of the traditional rigid printed wiring board (PWB). To achieve a real design freedom, a formable multilayer PWB structure is needed.This paper introduces the three-dimensional printed wiring board and the 3D integration of electronics and mechanics. The 3D Integration of electronics and mechanics increases design freedom and space utilization efficiency e.g. in portable devices. The 3D Integration technology is enabled by thermoplastic PWB material innovations and a new kind of system integration process. Thermoplastics are formable and they are widely used in many fields, but as a substrate for a multilayer PWB, they are rather new. Furthermore, this paper discusses the benefits and challenges of the 3D integration of electronics and mechanics and the special characteristics of its system design process. Integration of electronics and mechanics has an effect on the design process management. Design phases must be coherent and teamwork needs to be well organized. In addition, special requirements for testing are presented.",
author = "T Peltola and P Mansikkamaki and EO Ristolainen",
note = "Contribution: organisation=ele,FACT1=1",
year = "2005",
language = "English",
isbn = "0-7803-9085-7",
pages = "5--8",
booktitle = "2005 IEEE/CPMT 10th International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces. March 16-18, 2005, Irvine, CA, USA",
publisher = "IEEE",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - 3D integration of electronics and mechanics

AU - Peltola, T

AU - Mansikkamaki, P

AU - Ristolainen, EO

N1 - Contribution: organisation=ele,FACT1=1

PY - 2005

Y1 - 2005

N2 - Nowadays, the design is one of the key features for all consumer products. All the novel functions must be available inside fashionable covers. However, the most interesting product shapes are not always possible due the restriction of the traditional rigid printed wiring board (PWB). To achieve a real design freedom, a formable multilayer PWB structure is needed.This paper introduces the three-dimensional printed wiring board and the 3D integration of electronics and mechanics. The 3D Integration of electronics and mechanics increases design freedom and space utilization efficiency e.g. in portable devices. The 3D Integration technology is enabled by thermoplastic PWB material innovations and a new kind of system integration process. Thermoplastics are formable and they are widely used in many fields, but as a substrate for a multilayer PWB, they are rather new. Furthermore, this paper discusses the benefits and challenges of the 3D integration of electronics and mechanics and the special characteristics of its system design process. Integration of electronics and mechanics has an effect on the design process management. Design phases must be coherent and teamwork needs to be well organized. In addition, special requirements for testing are presented.

AB - Nowadays, the design is one of the key features for all consumer products. All the novel functions must be available inside fashionable covers. However, the most interesting product shapes are not always possible due the restriction of the traditional rigid printed wiring board (PWB). To achieve a real design freedom, a formable multilayer PWB structure is needed.This paper introduces the three-dimensional printed wiring board and the 3D integration of electronics and mechanics. The 3D Integration of electronics and mechanics increases design freedom and space utilization efficiency e.g. in portable devices. The 3D Integration technology is enabled by thermoplastic PWB material innovations and a new kind of system integration process. Thermoplastics are formable and they are widely used in many fields, but as a substrate for a multilayer PWB, they are rather new. Furthermore, this paper discusses the benefits and challenges of the 3D integration of electronics and mechanics and the special characteristics of its system design process. Integration of electronics and mechanics has an effect on the design process management. Design phases must be coherent and teamwork needs to be well organized. In addition, special requirements for testing are presented.

M3 - Conference contribution

SN - 0-7803-9085-7

SP - 5

EP - 8

BT - 2005 IEEE/CPMT 10th International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces. March 16-18, 2005, Irvine, CA, USA

PB - IEEE

ER -