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3D-Printed Origami Packaging with Inkjet-Printed Antennas for RF Harvesting Sensors

Research output: Contribution to journalArticleScientificpeer-review

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3D-Printed Origami Packaging with Inkjet-Printed Antennas for RF Harvesting Sensors. / Kimionis, John; Isakov, Michael; Koh, Beom S.; Georgiadis, Apostolos; Tentzeris, Manos M.

In: IEEE Transactions on Microwave Theory and Techniques, Vol. 63, No. 12, 7327248, 01.12.2015, p. 4521-4532.

Research output: Contribution to journalArticleScientificpeer-review

Harvard

Kimionis, J, Isakov, M, Koh, BS, Georgiadis, A & Tentzeris, MM 2015, '3D-Printed Origami Packaging with Inkjet-Printed Antennas for RF Harvesting Sensors', IEEE Transactions on Microwave Theory and Techniques, vol. 63, no. 12, 7327248, pp. 4521-4532. https://doi.org/10.1109/TMTT.2015.2494580

APA

Kimionis, J., Isakov, M., Koh, B. S., Georgiadis, A., & Tentzeris, M. M. (2015). 3D-Printed Origami Packaging with Inkjet-Printed Antennas for RF Harvesting Sensors. IEEE Transactions on Microwave Theory and Techniques, 63(12), 4521-4532. [7327248]. https://doi.org/10.1109/TMTT.2015.2494580

Vancouver

Kimionis J, Isakov M, Koh BS, Georgiadis A, Tentzeris MM. 3D-Printed Origami Packaging with Inkjet-Printed Antennas for RF Harvesting Sensors. IEEE Transactions on Microwave Theory and Techniques. 2015 Dec 1;63(12):4521-4532. 7327248. https://doi.org/10.1109/TMTT.2015.2494580

Author

Kimionis, John ; Isakov, Michael ; Koh, Beom S. ; Georgiadis, Apostolos ; Tentzeris, Manos M. / 3D-Printed Origami Packaging with Inkjet-Printed Antennas for RF Harvesting Sensors. In: IEEE Transactions on Microwave Theory and Techniques. 2015 ; Vol. 63, No. 12. pp. 4521-4532.

Bibtex - Download

@article{c94b056aed984097a7d9f8a39611252c,
title = "3D-Printed Origami Packaging with Inkjet-Printed Antennas for RF Harvesting Sensors",
abstract = "This paper demonstrates the combination of additive manufacturing techniques for realizing complex 3D origami structures for high frequency applications. A 3D-printed compact package for enclosing radio frequency (RF) electronics is built, that features on-package antennas for RF signal reception (for harvesting or communication) at orthogonal orientations. Conventional 3D printing technologies often require significant amounts of time and supporting material to realize certain structures, such as hollow packages. In this work, instead of fabricating the package in its final 3D form, it is 3D-printed as a planar structure with {"}smart{"} shape-memory hinges that allow origami folding to a 3D shape after heating. This significantly reduces fabrication time and effectively eliminates the need for supporting material, thus minimizing the overall manufacturing cost. Metallization on the package is performed by directly inkjet printing conductive inks on top of the 3D-printed surface with a modified inkjet-printed process without the need for surface treatment or processing. Inkjet-printed on-package conductive features are successfully fabricated, that are combined with RF energy harvesting electronics to showcase the proof-of-concept of utilizing origami techniques to build fully 3D RF systems. The methodologies presented in this paper will be enabling the manufacturing of numerous real-time shape-changing 3D complex structures for electromagnetic applications.",
keywords = "3D printing, additive manufacturing, inkjet printing, origami electronics, RF harvesting",
author = "John Kimionis and Michael Isakov and Koh, {Beom S.} and Apostolos Georgiadis and Tentzeris, {Manos M.}",
year = "2015",
month = "12",
day = "1",
doi = "10.1109/TMTT.2015.2494580",
language = "English",
volume = "63",
pages = "4521--4532",
journal = "IEEE Transactions on Microwave Theory and Techniques",
issn = "0018-9480",
publisher = "Institute of Electrical and Electronics Engineers",
number = "12",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - 3D-Printed Origami Packaging with Inkjet-Printed Antennas for RF Harvesting Sensors

AU - Kimionis, John

AU - Isakov, Michael

AU - Koh, Beom S.

AU - Georgiadis, Apostolos

AU - Tentzeris, Manos M.

PY - 2015/12/1

Y1 - 2015/12/1

N2 - This paper demonstrates the combination of additive manufacturing techniques for realizing complex 3D origami structures for high frequency applications. A 3D-printed compact package for enclosing radio frequency (RF) electronics is built, that features on-package antennas for RF signal reception (for harvesting or communication) at orthogonal orientations. Conventional 3D printing technologies often require significant amounts of time and supporting material to realize certain structures, such as hollow packages. In this work, instead of fabricating the package in its final 3D form, it is 3D-printed as a planar structure with "smart" shape-memory hinges that allow origami folding to a 3D shape after heating. This significantly reduces fabrication time and effectively eliminates the need for supporting material, thus minimizing the overall manufacturing cost. Metallization on the package is performed by directly inkjet printing conductive inks on top of the 3D-printed surface with a modified inkjet-printed process without the need for surface treatment or processing. Inkjet-printed on-package conductive features are successfully fabricated, that are combined with RF energy harvesting electronics to showcase the proof-of-concept of utilizing origami techniques to build fully 3D RF systems. The methodologies presented in this paper will be enabling the manufacturing of numerous real-time shape-changing 3D complex structures for electromagnetic applications.

AB - This paper demonstrates the combination of additive manufacturing techniques for realizing complex 3D origami structures for high frequency applications. A 3D-printed compact package for enclosing radio frequency (RF) electronics is built, that features on-package antennas for RF signal reception (for harvesting or communication) at orthogonal orientations. Conventional 3D printing technologies often require significant amounts of time and supporting material to realize certain structures, such as hollow packages. In this work, instead of fabricating the package in its final 3D form, it is 3D-printed as a planar structure with "smart" shape-memory hinges that allow origami folding to a 3D shape after heating. This significantly reduces fabrication time and effectively eliminates the need for supporting material, thus minimizing the overall manufacturing cost. Metallization on the package is performed by directly inkjet printing conductive inks on top of the 3D-printed surface with a modified inkjet-printed process without the need for surface treatment or processing. Inkjet-printed on-package conductive features are successfully fabricated, that are combined with RF energy harvesting electronics to showcase the proof-of-concept of utilizing origami techniques to build fully 3D RF systems. The methodologies presented in this paper will be enabling the manufacturing of numerous real-time shape-changing 3D complex structures for electromagnetic applications.

KW - 3D printing

KW - additive manufacturing

KW - inkjet printing

KW - origami electronics

KW - RF harvesting

UR - http://www.scopus.com/inward/record.url?scp=84959503360&partnerID=8YFLogxK

U2 - 10.1109/TMTT.2015.2494580

DO - 10.1109/TMTT.2015.2494580

M3 - Article

VL - 63

SP - 4521

EP - 4532

JO - IEEE Transactions on Microwave Theory and Techniques

JF - IEEE Transactions on Microwave Theory and Techniques

SN - 0018-9480

IS - 12

M1 - 7327248

ER -