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A Long-term reliability of adhesive flip chip joints using very thin chips

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Details

Original languageEnglish
Title of host publicationProceedings of First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Incorporating POLY, PEP & Adhesives in Electronics, Polytronic 2001, Potsdam, Germany, October 21-24, 2001
Place of PublicationSaksa
Pages196-201
Publication statusPublished - 2001
Publication typeA4 Article in a conference publication

Publication forum classification