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A Study on the Microstructure of Sn-Ag-Cu Lead-Free Solder Joints in Pulse-Heated Reflow Soldering

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Details

Original languageEnglish
Title of host publicationThe IMAPS Nordic Annual Conference 2011, 5-8 June 2011, Espoo, Finland
Place of PublicationMölndal
PublisherIMAPS Nordic
Pages1-9
Number of pages9
Publication statusPublished - 2011
Publication typeA4 Article in a conference publication

Publication series

NameIMAPS Nordic Annual Conference
PublisherIMAPS Nordic

Publication forum classification