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ACF flip chip joints on LCP substrates with thin chips

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Details

Original languageEnglish
Title of host publication15th European Microelectronics and Packaging Conference & Exhibition, June 12-15, 2005, Brugge, Belgium
Pages272-277
Publication statusPublished - 2005
Publication typeA4 Article in a conference publication

Publication forum classification