Tampere University of Technology

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Additive and Digital Fabrication of 3D Interconnects in MEMS Packaging Using Printing Technologies

Research output: Book/ReportDoctoral thesisCollection of Articles

  1. 2018
  2. Published

    High-resolution E-jet Enhanced MEMS Packaging

    Laurila, M-M., Khorramdel Vahed, B. & Mäntysalo, M., 27 Aug 2018, p. NA. 1 p.

    Research output: Other conference contributionPaper, poster or abstractScientific