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Advancements in Solution Processable Devices using Metal Oxides For Printed Internet-of-Things Objects

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Details

Original languageEnglish
Title of host publication2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019
PublisherIEEE
Pages160-162
Number of pages3
ISBN (Electronic)9781538665084
DOIs
Publication statusPublished - 1 Mar 2019
Publication typeA4 Article in a conference publication
EventElectron Devices Technology and Manufacturing Conference - Singapore, Singapore
Duration: 12 Mar 201915 Mar 2019

Conference

ConferenceElectron Devices Technology and Manufacturing Conference
CountrySingapore
CitySingapore
Period12/03/1915/03/19

Abstract

Internet-of-things (IoT) objects are expected to exceed 75 billion objects by 2020, and a large part of the expansion is expected to be at a finer granularity than existing silicon-based IoT objects (i.e. tablets and cell phones) can deliver [1]. Currently, placing a room light or a thermostat on the internet for remote control is considered progressive. However, if printed electronics can achieve performance increases, then IoT objects could be affixed to almost anything, such as coffee creamer cartons, cereal boxes, or that missing sock. Each of these IoT objects could be driving a sensor, perhaps position, temperature or pressure, essentially a multitude of applications. In order for IoT objects to emulate a simple postage stamp, with self-powering from energy scavenging and local energy storage, all housed in a non-toxic flexible form factor, advances in solution processable devices need to occur.

Keywords

  • ALD, CMOS and SOI, energy scavenging, IoT, low-power electronics, Manufacturing, NDR, tunnel diodes

Publication forum classification