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Advancements in Solution Processable Devices using Metal Oxides For Printed Internet-of-Things Objects

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Standard

Advancements in Solution Processable Devices using Metal Oxides For Printed Internet-of-Things Objects. / Berger, Paul R.; Li, Miao; Mattei, Ryan M.; Niang, Maimouna A.; Talisa, Noah; Tripepi, Michael; Harris, Brandon; Bhalerao, Sagar R.; Chowdhury, Enam A.; Winter, Charles H.; Lupo, Donald.

2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019. IEEE, 2019. p. 160-162.

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Harvard

Berger, PR, Li, M, Mattei, RM, Niang, MA, Talisa, N, Tripepi, M, Harris, B, Bhalerao, SR, Chowdhury, EA, Winter, CH & Lupo, D 2019, Advancements in Solution Processable Devices using Metal Oxides For Printed Internet-of-Things Objects. in 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019. IEEE, pp. 160-162, Electron Devices Technology and Manufacturing Conference, Singapore, Singapore, 12/03/19. https://doi.org/10.1109/EDTM.2019.8731322

APA

Berger, P. R., Li, M., Mattei, R. M., Niang, M. A., Talisa, N., Tripepi, M., ... Lupo, D. (2019). Advancements in Solution Processable Devices using Metal Oxides For Printed Internet-of-Things Objects. In 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019 (pp. 160-162). IEEE. https://doi.org/10.1109/EDTM.2019.8731322

Vancouver

Berger PR, Li M, Mattei RM, Niang MA, Talisa N, Tripepi M et al. Advancements in Solution Processable Devices using Metal Oxides For Printed Internet-of-Things Objects. In 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019. IEEE. 2019. p. 160-162 https://doi.org/10.1109/EDTM.2019.8731322

Author

Berger, Paul R. ; Li, Miao ; Mattei, Ryan M. ; Niang, Maimouna A. ; Talisa, Noah ; Tripepi, Michael ; Harris, Brandon ; Bhalerao, Sagar R. ; Chowdhury, Enam A. ; Winter, Charles H. ; Lupo, Donald. / Advancements in Solution Processable Devices using Metal Oxides For Printed Internet-of-Things Objects. 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019. IEEE, 2019. pp. 160-162

Bibtex - Download

@inproceedings{7ba878079ffd41b290c4055f7a553061,
title = "Advancements in Solution Processable Devices using Metal Oxides For Printed Internet-of-Things Objects",
abstract = "Internet-of-things (IoT) objects are expected to exceed 75 billion objects by 2020, and a large part of the expansion is expected to be at a finer granularity than existing silicon-based IoT objects (i.e. tablets and cell phones) can deliver [1]. Currently, placing a room light or a thermostat on the internet for remote control is considered progressive. However, if printed electronics can achieve performance increases, then IoT objects could be affixed to almost anything, such as coffee creamer cartons, cereal boxes, or that missing sock. Each of these IoT objects could be driving a sensor, perhaps position, temperature or pressure, essentially a multitude of applications. In order for IoT objects to emulate a simple postage stamp, with self-powering from energy scavenging and local energy storage, all housed in a non-toxic flexible form factor, advances in solution processable devices need to occur.",
keywords = "ALD, CMOS and SOI, energy scavenging, IoT, low-power electronics, Manufacturing, NDR, tunnel diodes",
author = "Berger, {Paul R.} and Miao Li and Mattei, {Ryan M.} and Niang, {Maimouna A.} and Noah Talisa and Michael Tripepi and Brandon Harris and Bhalerao, {Sagar R.} and Chowdhury, {Enam A.} and Winter, {Charles H.} and Donald Lupo",
year = "2019",
month = "3",
day = "1",
doi = "10.1109/EDTM.2019.8731322",
language = "English",
pages = "160--162",
booktitle = "2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019",
publisher = "IEEE",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - Advancements in Solution Processable Devices using Metal Oxides For Printed Internet-of-Things Objects

AU - Berger, Paul R.

AU - Li, Miao

AU - Mattei, Ryan M.

AU - Niang, Maimouna A.

AU - Talisa, Noah

AU - Tripepi, Michael

AU - Harris, Brandon

AU - Bhalerao, Sagar R.

AU - Chowdhury, Enam A.

AU - Winter, Charles H.

AU - Lupo, Donald

PY - 2019/3/1

Y1 - 2019/3/1

N2 - Internet-of-things (IoT) objects are expected to exceed 75 billion objects by 2020, and a large part of the expansion is expected to be at a finer granularity than existing silicon-based IoT objects (i.e. tablets and cell phones) can deliver [1]. Currently, placing a room light or a thermostat on the internet for remote control is considered progressive. However, if printed electronics can achieve performance increases, then IoT objects could be affixed to almost anything, such as coffee creamer cartons, cereal boxes, or that missing sock. Each of these IoT objects could be driving a sensor, perhaps position, temperature or pressure, essentially a multitude of applications. In order for IoT objects to emulate a simple postage stamp, with self-powering from energy scavenging and local energy storage, all housed in a non-toxic flexible form factor, advances in solution processable devices need to occur.

AB - Internet-of-things (IoT) objects are expected to exceed 75 billion objects by 2020, and a large part of the expansion is expected to be at a finer granularity than existing silicon-based IoT objects (i.e. tablets and cell phones) can deliver [1]. Currently, placing a room light or a thermostat on the internet for remote control is considered progressive. However, if printed electronics can achieve performance increases, then IoT objects could be affixed to almost anything, such as coffee creamer cartons, cereal boxes, or that missing sock. Each of these IoT objects could be driving a sensor, perhaps position, temperature or pressure, essentially a multitude of applications. In order for IoT objects to emulate a simple postage stamp, with self-powering from energy scavenging and local energy storage, all housed in a non-toxic flexible form factor, advances in solution processable devices need to occur.

KW - ALD

KW - CMOS and SOI

KW - energy scavenging

KW - IoT

KW - low-power electronics

KW - Manufacturing

KW - NDR

KW - tunnel diodes

U2 - 10.1109/EDTM.2019.8731322

DO - 10.1109/EDTM.2019.8731322

M3 - Conference contribution

SP - 160

EP - 162

BT - 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019

PB - IEEE

ER -