Analysis of Laser Bar Bonding Reliability on Different Substrates
Research output: Contribution to journal › Article › Scientific › peer-review
Details
| Original language | English |
|---|---|
| Pages (from-to) | 160-172 |
| Journal | International Journal of Microcircuits & Electronic Packaging |
| Volume | 24 |
| Issue number | 2 |
| Publication status | Published - 2001 |
| Publication type | A1 Journal article-refereed |