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Analysis of Laser Bar Bonding Reliability on Different Substrates

Research output: Contribution to journalArticleScientificpeer-review

Details

Original languageEnglish
Pages (from-to)160-172
JournalInternational Journal of Microcircuits & Electronic Packaging
Volume24
Issue number2
Publication statusPublished - 2001
Publication typeA1 Journal article-refereed

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