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Chip-to-package wireless power transfer and its application to mm-Wave antennas and monolithic radiometric receivers

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Details

Original languageEnglish
Title of host publicationRSW 2013 - 2013 IEEE Radio and Wireless Symposium - RWW 2013
Pages202-204
Number of pages3
DOIs
Publication statusPublished - 2013
Publication typeA4 Article in a conference publication
Event2013 IEEE Radio and Wireless Symposium, RSW 2013 - 2013 7th IEEE Radio and Wireless Week, RWW 2013 - Austin, TX, United States
Duration: 20 Jan 201323 Jan 2013

Conference

Conference2013 IEEE Radio and Wireless Symposium, RSW 2013 - 2013 7th IEEE Radio and Wireless Week, RWW 2013
CountryUnited States
CityAustin, TX
Period20/01/1323/01/13

Abstract

A chip-to-package wireless power transfer concept is applied to MMIC and antennas on LCP substrate is presented. Electromagnetic simulations show the feasibility of the proposed approach. As a benchmarking topology at the working frequency of 35.4 GHz, an Archimedean spiral antenna matched to a heterogeneous transformer, which couples the power received by the antenna to the chip, has been simulated. Transistor level circuit simulations are also proposed for the LNA and the detector, which together will constitute the system-on-chip (SoC) radiometer to be integrated in the LCP-SoP.

Keywords

  • Electromagnetic coupling, flexible electronics, heterogeneous integration, imaging, LNA, mm-wave, SoC, SoP