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Combination of E-jet and inkjet printing for additive fabrication of multilayer high-density RDL of silicon interposer

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Original languageEnglish
Pages (from-to)1217-1224
Number of pages8
JournalIEEE Transactions on Electron Devices
Volume64
Issue number3
DOIs
Publication statusPublished - 1 Mar 2017
Publication typeA1 Journal article-refereed

Abstract

The additive nature and high resolution of electrohydrodynamic inkjet (E-jet) printing can be utilized for manufacturing micrometer scale conductive tracks such as those required in the high-density redistribution layers (RDLs) of silicon interposers used in electronics packaging for 3-D integration. Compared to the current lithographic fabrication method, this approach promises to increase the customizability of the process and reduce the amount of waste materials, thereby lowering the costs and the environmental impact of the manufacturing process. In this paper, multilayer interdigitated capacitor and meander resistor structures with 5/5 μm conductor width/spacing are used to demonstrate the feasibility of E-jet printing of high-density multilayer RDLs. A sheet resistance of 28.5 Ω/square was achieved for the first metallization layer (MET1) conductors and 313.2 7Ω/square for the MET2 conductors. The thickness of the conductors was 6.9 μm for MET1 and 5.4 μm for MET2.

Keywords

  • 3-D integration, additive manufacturing, electrohydrodynamic inkjet (E-jet) printing, electronics packaging, high-density printing, printed electronics, silicon interposer

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