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Effect of inter-layer pressure on dielectric breakdown characteristics of metallized polymer films for capacitor applications

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Details

Original languageEnglish
Title of host publicationIEEE International Conference on Solid Dielectrics ICSD, June 30th - July 4th 2013, Bologna, Italy
PublisherInstitute of Electrical and Electronics Engineers IEEE
Pages682-687
Number of pages6
ISBN (Print)978-1-4799-0807-3
DOIs
Publication statusPublished - 2013
Publication typeA4 Article in a conference publication

Publication series

NameIEEE International Conference on Solid Dielectrics
ISSN (Print)2159-1687

Publication forum classification