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Effect of reflow profile on wetting and intermetallic formation between Sn/Ag/Cu solder components and printed circuit boards

Research output: Contribution to journalArticleScientificpeer-review


Original languageEnglish
Pages (from-to)18-25
JournalSoldering and Surface Mount Technology
Issue number2
Publication statusPublished - 2002
Publication typeA1 Journal article-refereed

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