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Effect of substrate material and thickness on reliability of ACA bonded flip chip joints

Research output: Contribution to journalArticleScientificpeer-review

Details

Original languageEnglish
Pages (from-to)16-23
Number of pages8
JournalSoldering and Surface Mount Technology
Volume21
Issue number3
DOIs
Publication statusPublished - 2009
Publication typeA1 Journal article-refereed

Publication forum classification