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Effect of thermal aging and salt spray testing on reliability and mechanical strength of Sn-58Bi lead-free solder

Research output: Contribution to journalArticleScientificpeer-review

Details

Original languageEnglish
Pages (from-to)1778-1785
Number of pages8
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume3
Issue number10
DOIs
Publication statusPublished - 2013
Publication typeA1 Journal article-refereed

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