Tampere University of Technology

TUTCRIS Research Portal

Effects of Bonding Parameters on Quality of Adhesive Flip Chip Joints

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Details

Original languageEnglish
Title of host publicationThe Second IEEE International Symposium on Polymeric Electronics Packaging, October 24-28, 1999, Radisson SAS Scandinavia Hotel, Gothenburg, Sweden
Place of PublicationGöteborg
Pages147-152
Publication statusPublished - 1999
Publication typeA4 Article in a conference publication

Publication forum classification