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Effects of Misalignment on Reliability of Flip Chip Solder Joints Using FEA

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Details

Original languageEnglish
Title of host publicationIMAPS - Europe Cracow 2002, Proceedings on European Microelectronics Packaging & Interconnection Symposium, 16-18 June, 2002, Sofitel Hotel, Cracow, Poland
Pages284-288
Publication statusPublished - 2002
Publication typeA4 Article in a conference publication

Publication forum classification