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Evaluation of Rotary Screen Printed High Density Interconnects for R2R Fabricated Hybrid Systems

Research output: Other conference contributionPaper, poster or abstract

Details

Original languageEnglish
StatePublished - 28 Nov 2016
Event2016 Materials Research Society Fall Meeting and Exhibit - Hynes Convention Center, Boston, United States
Duration: 27 Nov 20162 Dec 2016
https://www.mrs.org/fall2016

Conference

Conference2016 Materials Research Society Fall Meeting and Exhibit
Abbreviated title2016 MRS Fall Meeting
CountryUnited States
CityBoston
Period27/11/162/12/16
Internet address

Abstract

With the burgeoning development of the internet of everything (IoE), research involving high-speed, low cost, and large volume electronics manufacturing is highly attractive. Hybrid electronic systems, involving flexible printed and traditional silicon components, present early enablers for the large scale fabrication of printed electronics with a high level of computational power. With this possibility, there may be a way to produce the trillions of sensors needed for the fruition of the IoE.
Of particular interest, is the ease at which rotary screen printing can be utilized in the roll-to-roll (R2R) fabrication process of flexible electronics. However, there are challenges to be overcome regarding the printed line resolution and hybrid integration utilizing high speed rotary screen printed backplanes. Our study, focused on R2R screen printed high density interconnects on PET, utilizing commercially available silver pastes. To evaluate the hybrid integration, we designed symmetrical daisy chain bare dies with 80 pads and varying pitch sizes of 150, 175, and 200 µm. Initially we investigated the use of anisotropically conductive adhesives and the comparison of native and gold stud bumped chips. Subsequently, we investigated the optimization of the printed traces via calendaring in an effort to improve the flip-chip attachment. The R2R calendaring was used to increase the line height uniformity of the printed traces and decrease the interconnects surface roughness.

Publication forum classification

Field of science, Statistics Finland