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Exploiting 3D printed substrate for microfluidic SIW sensor

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Details

Original languageEnglish
Title of host publicationEuropean Microwave Week 2015: "Freedom Through Microwaves", EuMW 2015 - Conference Proceedings; 2015 45th European Microwave Conference Proceedings, EuMC
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages28-31
Number of pages4
ISBN (Electronic)9782874870392
DOIs
Publication statusPublished - 2 Dec 2015
Publication typeA4 Article in a conference publication
Event45th European Microwave Conference, EuMC 2015 - Paris, France
Duration: 7 Sep 201510 Sep 2015

Conference

Conference45th European Microwave Conference, EuMC 2015
CountryFrance
CityParis
Period7/09/1510/09/15

Abstract

This paper exploits the possibility of the 3D printing for microwave sensor purposes. Because of the complex shapes allowed by this emerging technology, a fully-custom microfluidic sensor can be embedded directly during the substrate preparation. By this way, a simple approach in sensor design can be achieved together with a reduction of the manufacturing time, costs and overall complexity of the sensor. 3D printed microwave devices are very attractive for the future generation of Wireless Sensor Networks and of the Internet of Things. The proposed microfluidic sensor exploits the substrate integrated waveguide technology to keep high the quality factor and to merge the requirements of planar integration of further blocks. The aim of this sensor is a real time characterization of fluids across the lower UWB frequency band. The design, a first prototype and measurements are shown to exhibit the potentiality of this technique.

Keywords

  • 3D printing technolgies, Internet of Things (IoT), Microfluidic, Substrate integrated waveguide (SIW), wireless sensor networks (WSN)