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Field Collapse Event ESD Test Method

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Details

Original languageEnglish
Title of host publication2014 36TH Electrical overstress/electrostatic discharge symposium (EOS/ESD)
PublisherIEEE COMPUTER SOC
Number of pages6
Publication statusPublished - 2014
Publication typeA4 Article in a conference publication
EventElectrical Overstress/Electrostatic Discharge Symposium -
Duration: 1 Jan 1900 → …

Publication series

NameElectrical Overstress Electrostatic Discharge Symposium
PublisherIEEE COMPUTER SOC
ISSN (Print)0739-5159

Conference

ConferenceElectrical Overstress/Electrostatic Discharge Symposium
Period1/01/00 → …

Abstract

A novel field collapse event ESD test method is presented in this paper. The device under test is continuously grounded in an electrostatic field and when the field is removed it drives current through the device. We show with measurements and simulations how to use this method to test ESD immunity of electronic products.

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