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Flip chip attachment on flexible pen-substrate using an ACF

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Details

Original languageEnglish
Title of host publication3rd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, 21-23 October 2003, Montreux, Switzerland
Pages345-349
Publication statusPublished - 2003
Publication typeA4 Article in a conference publication

Publication forum classification