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Geometric linewidth and the impact of thermal processing on the stress regimes induced by electroless copper metallization for Si integrated circuit interconnect technology

Research output: Contribution to journalArticleScientificpeer-review

Details

Original languageEnglish
Pages (from-to)7596-7602
JournalJournal of Applied Physics
Volume96
Issue number12
DOIs
Publication statusPublished - 2004
Externally publishedYes
Publication typeA1 Journal article-refereed

Publication forum classification