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Geometry Analysis in Screen-Printed Stretchable Interconnects

Research output: Contribution to journalArticleScientificpeer-review

Details

Original languageEnglish
Pages (from-to)1344-1352
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume8
Issue number8
Early online date8 Jul 2018
DOIs
Publication statusPublished - Aug 2018
Publication typeA1 Journal article-refereed

Abstract

Deformability of interconnects and conductors as the skeleton of soft electronic devices plays an important role in the stretchability of the whole system. To make the interconnects stretchable, either employing deformable materials or tailoring the design are the primary approaches. It is also possible to combine the two strategies. In advanced stretchable electronic circuits, there is a frequently need for the interconnects to transform from a narrow to a wide geometry. Therefore, this paper assesses three different geometries that accommodate a narrow-to-wide transition along the interconnects. First, the geometry is modeled using Finite Element (FE) analysis. Second, in order to verify the accuracy of the FE model, screen-printed interconnects are fabricated accordingly by using silver flake ink on a deformable substrate. The geometrical modification shows a considerable improvement in the stretchability of the whole system. Additionally, the effect of encapsulation with thermoplastic polyurethane (TPU) on the performance of stretchable interconnects is investigated.

Keywords

  • Conductivity, finite element analysis, Geometry, Integrated circuit interconnections, Plastics, printed electronics, screen-printing, Strain, Stress, stretchable interconnects., Substrates

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