Geometry Analysis in Screen-Printed Stretchable Interconnects
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Geometry Analysis in Screen-Printed Stretchable Interconnects. / Mosallaei, Mahmoud; Jokinen, Jarno; Honkanen, Mari; Iso-Ketola, Pekka; Vippola, Minnamari; Vanhala, Jukka; Kanerva, Mikko; Mantysalo, Matti.
In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 8, No. 8, 08.2018, p. 1344-1352.Research output: Contribution to journal › Article › Scientific › peer-review
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TY - JOUR
T1 - Geometry Analysis in Screen-Printed Stretchable Interconnects
AU - Mosallaei, Mahmoud
AU - Jokinen, Jarno
AU - Honkanen, Mari
AU - Iso-Ketola, Pekka
AU - Vippola, Minnamari
AU - Vanhala, Jukka
AU - Kanerva, Mikko
AU - Mantysalo, Matti
PY - 2018/8
Y1 - 2018/8
N2 - Deformability of interconnects and conductors as the skeleton of soft electronic devices plays an important role in the stretchability of the whole system. To make the interconnects stretchable, either employing deformable materials or tailoring the design are the primary approaches. It is also possible to combine the two strategies. In advanced stretchable electronic circuits, there is a frequently need for the interconnects to transform from a narrow to a wide geometry. Therefore, this paper assesses three different geometries that accommodate a narrow-to-wide transition along the interconnects. First, the geometry is modeled using Finite Element (FE) analysis. Second, in order to verify the accuracy of the FE model, screen-printed interconnects are fabricated accordingly by using silver flake ink on a deformable substrate. The geometrical modification shows a considerable improvement in the stretchability of the whole system. Additionally, the effect of encapsulation with thermoplastic polyurethane (TPU) on the performance of stretchable interconnects is investigated.
AB - Deformability of interconnects and conductors as the skeleton of soft electronic devices plays an important role in the stretchability of the whole system. To make the interconnects stretchable, either employing deformable materials or tailoring the design are the primary approaches. It is also possible to combine the two strategies. In advanced stretchable electronic circuits, there is a frequently need for the interconnects to transform from a narrow to a wide geometry. Therefore, this paper assesses three different geometries that accommodate a narrow-to-wide transition along the interconnects. First, the geometry is modeled using Finite Element (FE) analysis. Second, in order to verify the accuracy of the FE model, screen-printed interconnects are fabricated accordingly by using silver flake ink on a deformable substrate. The geometrical modification shows a considerable improvement in the stretchability of the whole system. Additionally, the effect of encapsulation with thermoplastic polyurethane (TPU) on the performance of stretchable interconnects is investigated.
KW - Conductivity
KW - finite element analysis
KW - Geometry
KW - Integrated circuit interconnections
KW - Plastics
KW - printed electronics
KW - screen-printing
KW - Strain
KW - Stress
KW - stretchable interconnects.
KW - Substrates
U2 - 10.1109/TCPMT.2018.2854635
DO - 10.1109/TCPMT.2018.2854635
M3 - Article
VL - 8
SP - 1344
EP - 1352
JO - IEEE Transactions on Components, Packaging and Manufacturing Technology
JF - IEEE Transactions on Components, Packaging and Manufacturing Technology
SN - 2156-3950
IS - 8
ER -