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High density R2R Screen Printed Silver Interconnections for Hybrid System Integration

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Standard

High density R2R Screen Printed Silver Interconnections for Hybrid System Integration. / Kraft, Thomas; Leppänen, Lydia ; Kololuoma, Terho; Lahokallio, Sanna; Frisk, Laura; Mäntysalo, Matti.

6th Electronic System-Integration Technology Conference (ESTC). IEEE, 2016.

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Harvard

Kraft, T, Leppänen, L, Kololuoma, T, Lahokallio, S, Frisk, L & Mäntysalo, M 2016, High density R2R Screen Printed Silver Interconnections for Hybrid System Integration. in 6th Electronic System-Integration Technology Conference (ESTC). IEEE, Electronics system integration technologies conference, 1/01/14. https://doi.org/10.1109/ESTC.2016.7764477

APA

Kraft, T., Leppänen, L., Kololuoma, T., Lahokallio, S., Frisk, L., & Mäntysalo, M. (2016). High density R2R Screen Printed Silver Interconnections for Hybrid System Integration. In 6th Electronic System-Integration Technology Conference (ESTC) IEEE. https://doi.org/10.1109/ESTC.2016.7764477

Vancouver

Kraft T, Leppänen L, Kololuoma T, Lahokallio S, Frisk L, Mäntysalo M. High density R2R Screen Printed Silver Interconnections for Hybrid System Integration. In 6th Electronic System-Integration Technology Conference (ESTC). IEEE. 2016 https://doi.org/10.1109/ESTC.2016.7764477

Author

Kraft, Thomas ; Leppänen, Lydia ; Kololuoma, Terho ; Lahokallio, Sanna ; Frisk, Laura ; Mäntysalo, Matti. / High density R2R Screen Printed Silver Interconnections for Hybrid System Integration. 6th Electronic System-Integration Technology Conference (ESTC). IEEE, 2016.

Bibtex - Download

@inproceedings{6fc6255439ab4d9aafa965366d8da2d0,
title = "High density R2R Screen Printed Silver Interconnections for Hybrid System Integration",
abstract = "In this case study, we investigated the minimum line width and spacing for roll-to-roll (R2R) screen printed silver interconnections on polyethylene terephthalate (PET). This initial pilot investigation involved rotary screen printing 16 high density I/0 patterns while alternating pitch (150, 175, 200, and 250 µm) and nominal screen linewidth (50, 75, 100, 150 µm). Based on those results, we chose the Asahi silver nanoparticle ink and StorkS305 screen to compare three printed chip bonding test patterns utilizing a nominal line width of 75 µm (average printed line width was 115 µm), and a pitch of 150, 175 or 200 µm. Flip chip bonding of daisy chain bare dies was used to compare the effect of gold stud bumping and the choice of anisotropic conductive adhesive (ACA). Even though gold stud bumps ensured reliable connections, the choice of the ACA for unbumped chips proved uncertain, which has provoked ongoing and future investigations.The results of this study shed significant and valuable light on high throughput R2R fabricated hybrid systems and necessary steps to be considered for future high density rotary screen printed hybrid electronic applications.",
author = "Thomas Kraft and Lydia Lepp{\"a}nen and Terho Kololuoma and Sanna Lahokallio and Laura Frisk and Matti M{\"a}ntysalo",
note = "INT=elt,{"}Lepp{\"a}nen, Lydia{"}",
year = "2016",
month = "12",
day = "5",
doi = "10.1109/ESTC.2016.7764477",
language = "English",
isbn = "978-1-5090-1403-3",
booktitle = "6th Electronic System-Integration Technology Conference (ESTC)",
publisher = "IEEE",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - High density R2R Screen Printed Silver Interconnections for Hybrid System Integration

AU - Kraft, Thomas

AU - Leppänen, Lydia

AU - Kololuoma, Terho

AU - Lahokallio, Sanna

AU - Frisk, Laura

AU - Mäntysalo, Matti

N1 - INT=elt,"Leppänen, Lydia"

PY - 2016/12/5

Y1 - 2016/12/5

N2 - In this case study, we investigated the minimum line width and spacing for roll-to-roll (R2R) screen printed silver interconnections on polyethylene terephthalate (PET). This initial pilot investigation involved rotary screen printing 16 high density I/0 patterns while alternating pitch (150, 175, 200, and 250 µm) and nominal screen linewidth (50, 75, 100, 150 µm). Based on those results, we chose the Asahi silver nanoparticle ink and StorkS305 screen to compare three printed chip bonding test patterns utilizing a nominal line width of 75 µm (average printed line width was 115 µm), and a pitch of 150, 175 or 200 µm. Flip chip bonding of daisy chain bare dies was used to compare the effect of gold stud bumping and the choice of anisotropic conductive adhesive (ACA). Even though gold stud bumps ensured reliable connections, the choice of the ACA for unbumped chips proved uncertain, which has provoked ongoing and future investigations.The results of this study shed significant and valuable light on high throughput R2R fabricated hybrid systems and necessary steps to be considered for future high density rotary screen printed hybrid electronic applications.

AB - In this case study, we investigated the minimum line width and spacing for roll-to-roll (R2R) screen printed silver interconnections on polyethylene terephthalate (PET). This initial pilot investigation involved rotary screen printing 16 high density I/0 patterns while alternating pitch (150, 175, 200, and 250 µm) and nominal screen linewidth (50, 75, 100, 150 µm). Based on those results, we chose the Asahi silver nanoparticle ink and StorkS305 screen to compare three printed chip bonding test patterns utilizing a nominal line width of 75 µm (average printed line width was 115 µm), and a pitch of 150, 175 or 200 µm. Flip chip bonding of daisy chain bare dies was used to compare the effect of gold stud bumping and the choice of anisotropic conductive adhesive (ACA). Even though gold stud bumps ensured reliable connections, the choice of the ACA for unbumped chips proved uncertain, which has provoked ongoing and future investigations.The results of this study shed significant and valuable light on high throughput R2R fabricated hybrid systems and necessary steps to be considered for future high density rotary screen printed hybrid electronic applications.

U2 - 10.1109/ESTC.2016.7764477

DO - 10.1109/ESTC.2016.7764477

M3 - Conference contribution

SN - 978-1-5090-1403-3

BT - 6th Electronic System-Integration Technology Conference (ESTC)

PB - IEEE

ER -