High-resolution E-jet Enhanced MEMS Packaging
Research output: Other conference contribution › Paper, poster or abstract › Scientific
|Number of pages||1|
|Publication status||Published - 27 Aug 2018|
|Event||First International Conference on 4D Materials and Systems (4DMS) - Yamagata University, Yonezawa Campus, Yonezawa, Japan|
Duration: 26 Aug 2018 → 30 Aug 2018
High-resolution electrohydrodynamic inkjet printing has potential to simplify the existing MEMS package fabrication through its additive and digital properties without sacrifices in the I/O density of the package. Initially, the replacement of certain lithographic process steps would lead to decreased material consumption and increased cost-effectiveness of the package fabrication; in long term, the large-scale adoption of additive process steps would enable increasing device customizability and lead to cost-effective fabrication of small batches and even fully tailored device specific MEMS packages. In our work, we have demonstrated the feasibility of this approach by replacing selected lithographic process steps by using high-resolution inkjet technology (Super Inkjet, SIJ Tech.) for metallization of high-density redistribution layers (RDL), metallization of through-silicon-vias (TSV) and fabrication of under bump metallization (UBM).
- electrohydrodynamic inkjet (E-jet) printing, MEMS packaging, Heterogenous integration