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High-resolution E-jet Enhanced MEMS Packaging

Research output: Other conference contributionPaper, poster or abstractScientific

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High-resolution E-jet Enhanced MEMS Packaging. / Laurila, Mika-Matti; Khorramdel Vahed, Behnam; Mäntysalo, Matti.

2018. NA Paper presented at First International Conference on 4D Materials and Systems (4DMS), Yonezawa, Japan.

Research output: Other conference contributionPaper, poster or abstractScientific

Harvard

Laurila, M-M, Khorramdel Vahed, B & Mäntysalo, M 2018, 'High-resolution E-jet Enhanced MEMS Packaging' Paper presented at First International Conference on 4D Materials and Systems (4DMS), Yonezawa, Japan, 26/08/18 - 30/08/18, pp. NA.

APA

Laurila, M-M., Khorramdel Vahed, B., & Mäntysalo, M. (2018). High-resolution E-jet Enhanced MEMS Packaging. NA. Paper presented at First International Conference on 4D Materials and Systems (4DMS), Yonezawa, Japan.

Vancouver

Laurila M-M, Khorramdel Vahed B, Mäntysalo M. High-resolution E-jet Enhanced MEMS Packaging. 2018. Paper presented at First International Conference on 4D Materials and Systems (4DMS), Yonezawa, Japan.

Author

Laurila, Mika-Matti ; Khorramdel Vahed, Behnam ; Mäntysalo, Matti. / High-resolution E-jet Enhanced MEMS Packaging. Paper presented at First International Conference on 4D Materials and Systems (4DMS), Yonezawa, Japan.1 p.

Bibtex - Download

@conference{c539311db25d45859408ccc0cfedad46,
title = "High-resolution E-jet Enhanced MEMS Packaging",
abstract = "High-resolution electrohydrodynamic inkjet printing has potential to simplify the existing MEMS package fabrication through its additive and digital properties without sacrifices in the I/O density of the package. Initially, the replacement of certain lithographic process steps would lead to decreased material consumption and increased cost-effectiveness of the package fabrication; in long term, the large-scale adoption of additive process steps would enable increasing device customizability and lead to cost-effective fabrication of small batches and even fully tailored device specific MEMS packages. In our work, we have demonstrated the feasibility of this approach by replacing selected lithographic process steps by using high-resolution inkjet technology (Super Inkjet, SIJ Tech.) for metallization of high-density redistribution layers (RDL), metallization of through-silicon-vias (TSV) and fabrication of under bump metallization (UBM).",
keywords = "electrohydrodynamic inkjet (E-jet) printing, MEMS packaging, Heterogenous integration",
author = "Mika-Matti Laurila and {Khorramdel Vahed}, Behnam and Matti M{\"a}ntysalo",
year = "2018",
month = "8",
day = "27",
language = "English",
pages = "NA",
note = "First International Conference on 4D Materials and Systems (4DMS) ; Conference date: 26-08-2018 Through 30-08-2018",
url = "http://ma.ecsdl.org/content/MA2018-03/2/128.short",

}

RIS (suitable for import to EndNote) - Download

TY - CONF

T1 - High-resolution E-jet Enhanced MEMS Packaging

AU - Laurila, Mika-Matti

AU - Khorramdel Vahed, Behnam

AU - Mäntysalo, Matti

PY - 2018/8/27

Y1 - 2018/8/27

N2 - High-resolution electrohydrodynamic inkjet printing has potential to simplify the existing MEMS package fabrication through its additive and digital properties without sacrifices in the I/O density of the package. Initially, the replacement of certain lithographic process steps would lead to decreased material consumption and increased cost-effectiveness of the package fabrication; in long term, the large-scale adoption of additive process steps would enable increasing device customizability and lead to cost-effective fabrication of small batches and even fully tailored device specific MEMS packages. In our work, we have demonstrated the feasibility of this approach by replacing selected lithographic process steps by using high-resolution inkjet technology (Super Inkjet, SIJ Tech.) for metallization of high-density redistribution layers (RDL), metallization of through-silicon-vias (TSV) and fabrication of under bump metallization (UBM).

AB - High-resolution electrohydrodynamic inkjet printing has potential to simplify the existing MEMS package fabrication through its additive and digital properties without sacrifices in the I/O density of the package. Initially, the replacement of certain lithographic process steps would lead to decreased material consumption and increased cost-effectiveness of the package fabrication; in long term, the large-scale adoption of additive process steps would enable increasing device customizability and lead to cost-effective fabrication of small batches and even fully tailored device specific MEMS packages. In our work, we have demonstrated the feasibility of this approach by replacing selected lithographic process steps by using high-resolution inkjet technology (Super Inkjet, SIJ Tech.) for metallization of high-density redistribution layers (RDL), metallization of through-silicon-vias (TSV) and fabrication of under bump metallization (UBM).

KW - electrohydrodynamic inkjet (E-jet) printing

KW - MEMS packaging

KW - Heterogenous integration

M3 - Paper, poster or abstract

SP - NA

ER -