Tampere University of Technology

TUTCRIS Research Portal

High-resolution E-jet Enhanced MEMS Packaging

Research output: Other conference contributionPaper, poster or abstractScientific

  1. 2018
  2. Published

    Additive and Digital Fabrication of 3D Interconnects in MEMS Packaging Using Printing Technologies

    Khorramdel, B., 15 Jun 2018, Tampere University of Technology. 55 p. (Tampere University of Technology. Publication; vol. 1553)

    Research output: Book/ReportDoctoral thesisCollection of Articles

  3. 2017
  4. Published

    Inkjet printing technology for increasing the I/O density of 3D TSV interposers

    Khorramdel, B., Liljeholm, J., Laurila, M-M., Lammi, T., Mårtensson, G., Ebefors, T., Niklaus, F. & Mäntysalo, M., 10 Apr 2017, In : Microsystems & Nanoengineering. 3, p. 17002

    Research output: Contribution to journalArticleScientificpeer-review

  5. Published

    Combination of E-jet and inkjet printing for additive fabrication of multilayer high-density RDL of silicon interposer

    Laurila, M-M., Khorramdel, B. & Mäntysalo, M., 1 Mar 2017, In : IEEE Transactions on Electron Devices. 64, 3, p. 1217-1224 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  6. 2015
  7. Published

    Metallization of high density TSVs using super inkjet technology

    Khorramdel, B., Laurila, M. M. & Mäntysalo, M., 1 May 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC). IEEE, p. 41-45 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review