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Improved Adhesion between a Sputtered Alumina Coating and a Copper Substrate

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Improved Adhesion between a Sputtered Alumina Coating and a Copper Substrate. / Järvinen, R.; Mäntylä, T.; Kettunen, P.

In: Thin Solid Films, Vol. 114, 1984, p. s. 311-.

Research output: Contribution to journalArticleScientificpeer-review

Harvard

Järvinen, R, Mäntylä, T & Kettunen, P 1984, 'Improved Adhesion between a Sputtered Alumina Coating and a Copper Substrate', Thin Solid Films, vol. 114, pp. s. 311-.

APA

Järvinen, R., Mäntylä, T., & Kettunen, P. (1984). Improved Adhesion between a Sputtered Alumina Coating and a Copper Substrate. Thin Solid Films, 114, s. 311-.

Vancouver

Järvinen R, Mäntylä T, Kettunen P. Improved Adhesion between a Sputtered Alumina Coating and a Copper Substrate. Thin Solid Films. 1984;114:s. 311-.

Author

Järvinen, R. ; Mäntylä, T. ; Kettunen, P. / Improved Adhesion between a Sputtered Alumina Coating and a Copper Substrate. In: Thin Solid Films. 1984 ; Vol. 114. pp. s. 311-.

Bibtex - Download

@article{c82118bebd924693a6f4409f37493307,
title = "Improved Adhesion between a Sputtered Alumina Coating and a Copper Substrate",
author = "R. J{\"a}rvinen and T. M{\"a}ntyl{\"a} and P. Kettunen",
note = "Contribution: organisation=mol,FACT1=1<br/>Publisher name: Elsevier",
year = "1984",
language = "English",
volume = "114",
pages = "s. 311--",
journal = "Thin Solid Films",
issn = "0040-6090",
publisher = "Elsevier",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Improved Adhesion between a Sputtered Alumina Coating and a Copper Substrate

AU - Järvinen, R.

AU - Mäntylä, T.

AU - Kettunen, P.

N1 - Contribution: organisation=mol,FACT1=1<br/>Publisher name: Elsevier

PY - 1984

Y1 - 1984

M3 - Article

VL - 114

SP - s. 311-

JO - Thin Solid Films

JF - Thin Solid Films

SN - 0040-6090

ER -