Tampere University of Technology

TUTCRIS Research Portal

Improving the fatigue life of a bare die flip chip by thinning

Research output: Contribution to journalArticleScientificpeer-review

Details

Original languageEnglish
Pages (from-to)s. 14
JournalSoldering and Surface Mount Technology
Volume15
Issue number3
Publication statusPublished - 2003
Publication typeA1 Journal article-refereed

Publication forum classification