Influence of Diffusion Barriers on Thermal Ageing Behaviour of Solar Absorber Coatings on Copper
|Title of host publication||Surface Modification Technologies XXVIII|
|Subtitle of host publication||Tampere University of Technology Tampere, Finland June 16-18, 2014|
|Number of pages||11|
|Publication status||Published - 2015|
|Publication type||A4 Article in a conference publication|
|Event||International Conference on Surface Modification Technologies - , Finland|
Duration: 1 Jan 2000 → …
|Conference||International Conference on Surface Modification Technologies|
|Period||1/01/00 → …|
The diffusion barriers studied were experimental magnetron sputtered Al layers and an industrial electroplated Ni layer between a Cu substrate and an absorber coating. The thicknesses of Al barriers were 0.1 µm and 0.5 µm, and a Ni barrier was 3 µm thick. As absorber coatings, magnetron sputtered chromium-based coatings and industrially electroplated black chromium coatings, were studied. The sputtered absorbers were a 3-layer stack of CrOx/Cr/CrOx with layer thicknesses of 0.05/0.03/0.05 µm, respectively. The electroplated black chromium coating had a thickness of 0.2 µm. Copper was used as a substrate for all of the absorbers studied.
The degradation of the absorber surfaces and influence of diffusion barriers were analysed by optical measurements (solar absorptance with a UV/Vis/NIR spectrophotometer and thermal emittance with a FTIR spectrophotometer), microstructural analyses were performed using a field-emission scanning electron microscope (FESEM). The absorbers were aged by means of heat treatments in a circulating air furnace at 200, 300, 400 and 500°C for two hours. The experimental analyses were performed before and after the ageing studies.
The results showed that without a barrier coating copper substrate atoms can diffuse into the absorber coating and through the coating to the surface of the coating and form CuO islands on the surface. These phenomena degraded optical selectivity of the absorber surface. The diffusion can be prevented or retarded with a diffusion barrier layer between the Cu substrate and the absorber coating. The 3-µm-thick Ni barrier prevented Cu diffusion and retained optical selectivity up to 500°C for two hours and the 0.5-µm-thick Al layer up to 400°C.