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Influence of moisture on the reliability of no-flow underfilled flip chips

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Details

Original languageEnglish
Title of host publication3rd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics 21-23 October 2003, Montreux, Switzerland
Pages63-67
Publication statusPublished - 2003
Publication typeA4 Article in a conference publication

Publication forum classification