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Inkjet catalyst printing and electroless copper deposition for low-cost patterned microwave passive devices on paper

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Inkjet catalyst printing and electroless copper deposition for low-cost patterned microwave passive devices on paper. / Cook, Benjamin S.; Fang, Yunnan; Kim, Sangkil; Le, Taoran; Goodwin, W. Brandon; Sandhage, Kenneth H.; Tentzeris, Manos M.

In: Electronic Materials Letters, Vol. 9, No. 5, 09.2013, p. 669-676.

Research output: Contribution to journalArticleScientificpeer-review

Harvard

Cook, BS, Fang, Y, Kim, S, Le, T, Goodwin, WB, Sandhage, KH & Tentzeris, MM 2013, 'Inkjet catalyst printing and electroless copper deposition for low-cost patterned microwave passive devices on paper', Electronic Materials Letters, vol. 9, no. 5, pp. 669-676. https://doi.org/10.1007/s13391-013-3027-0

APA

Cook, B. S., Fang, Y., Kim, S., Le, T., Goodwin, W. B., Sandhage, K. H., & Tentzeris, M. M. (2013). Inkjet catalyst printing and electroless copper deposition for low-cost patterned microwave passive devices on paper. Electronic Materials Letters, 9(5), 669-676. https://doi.org/10.1007/s13391-013-3027-0

Vancouver

Cook BS, Fang Y, Kim S, Le T, Goodwin WB, Sandhage KH et al. Inkjet catalyst printing and electroless copper deposition for low-cost patterned microwave passive devices on paper. Electronic Materials Letters. 2013 Sep;9(5):669-676. https://doi.org/10.1007/s13391-013-3027-0

Author

Cook, Benjamin S. ; Fang, Yunnan ; Kim, Sangkil ; Le, Taoran ; Goodwin, W. Brandon ; Sandhage, Kenneth H. ; Tentzeris, Manos M. / Inkjet catalyst printing and electroless copper deposition for low-cost patterned microwave passive devices on paper. In: Electronic Materials Letters. 2013 ; Vol. 9, No. 5. pp. 669-676.

Bibtex - Download

@article{44269bb0b503481bb426e95624ab3c04,
title = "Inkjet catalyst printing and electroless copper deposition for low-cost patterned microwave passive devices on paper",
abstract = "A scalable, low-cost process for fabricating copper-based microwave components on flexible, paper-based substrates is demonstrated. An inkjet printer is used to deposit a catalyst-bearing solution (tailored for such printing) in a desired pattern on commercially-available, recyclable, non-toxic (Teslin{\circledR}) paper. The catalystbearing paper is then immersed in an aqueous copper-bearing solution to allow for electroless deposition of a compact and conformal layer of copper in the inkjet-derived pattern. Meander monopole antennas comprised of such electroless-deposited copper patterns on paper exhibited comparable performance as for antennas synthesized via inkjet printing of a commercially-available silver nanoparticle ink. However, the solution-based patterning and electroless copper deposition process avoids nozzle-clogging problems and costs associated with noble metal particle-based inks. This process yields compact conductive copper layers without appreciable oxidation and without the need for an elevated temperature, post-deposition thermal treatment commonly required for noble metal particle-based ink processes. This low-cost copper patterning process is readily scalable on virtually any substrate and may be used to generate a variety of copper-based microwave devices on flexible, paper-based substrates.",
keywords = "antennas, copper metallization, flexible and recyclable substrates, inkjet printed electronics, paper-bearing electronics, RF devices",
author = "Cook, {Benjamin S.} and Yunnan Fang and Sangkil Kim and Taoran Le and Goodwin, {W. Brandon} and Sandhage, {Kenneth H.} and Tentzeris, {Manos M.}",
year = "2013",
month = "9",
doi = "10.1007/s13391-013-3027-0",
language = "English",
volume = "9",
pages = "669--676",
journal = "Electronic Materials Letters",
issn = "1738-8090",
publisher = "Springer Netherlands",
number = "5",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Inkjet catalyst printing and electroless copper deposition for low-cost patterned microwave passive devices on paper

AU - Cook, Benjamin S.

AU - Fang, Yunnan

AU - Kim, Sangkil

AU - Le, Taoran

AU - Goodwin, W. Brandon

AU - Sandhage, Kenneth H.

AU - Tentzeris, Manos M.

PY - 2013/9

Y1 - 2013/9

N2 - A scalable, low-cost process for fabricating copper-based microwave components on flexible, paper-based substrates is demonstrated. An inkjet printer is used to deposit a catalyst-bearing solution (tailored for such printing) in a desired pattern on commercially-available, recyclable, non-toxic (Teslin®) paper. The catalystbearing paper is then immersed in an aqueous copper-bearing solution to allow for electroless deposition of a compact and conformal layer of copper in the inkjet-derived pattern. Meander monopole antennas comprised of such electroless-deposited copper patterns on paper exhibited comparable performance as for antennas synthesized via inkjet printing of a commercially-available silver nanoparticle ink. However, the solution-based patterning and electroless copper deposition process avoids nozzle-clogging problems and costs associated with noble metal particle-based inks. This process yields compact conductive copper layers without appreciable oxidation and without the need for an elevated temperature, post-deposition thermal treatment commonly required for noble metal particle-based ink processes. This low-cost copper patterning process is readily scalable on virtually any substrate and may be used to generate a variety of copper-based microwave devices on flexible, paper-based substrates.

AB - A scalable, low-cost process for fabricating copper-based microwave components on flexible, paper-based substrates is demonstrated. An inkjet printer is used to deposit a catalyst-bearing solution (tailored for such printing) in a desired pattern on commercially-available, recyclable, non-toxic (Teslin®) paper. The catalystbearing paper is then immersed in an aqueous copper-bearing solution to allow for electroless deposition of a compact and conformal layer of copper in the inkjet-derived pattern. Meander monopole antennas comprised of such electroless-deposited copper patterns on paper exhibited comparable performance as for antennas synthesized via inkjet printing of a commercially-available silver nanoparticle ink. However, the solution-based patterning and electroless copper deposition process avoids nozzle-clogging problems and costs associated with noble metal particle-based inks. This process yields compact conductive copper layers without appreciable oxidation and without the need for an elevated temperature, post-deposition thermal treatment commonly required for noble metal particle-based ink processes. This low-cost copper patterning process is readily scalable on virtually any substrate and may be used to generate a variety of copper-based microwave devices on flexible, paper-based substrates.

KW - antennas

KW - copper metallization

KW - flexible and recyclable substrates

KW - inkjet printed electronics

KW - paper-bearing electronics

KW - RF devices

UR - http://www.scopus.com/inward/record.url?scp=84883808468&partnerID=8YFLogxK

U2 - 10.1007/s13391-013-3027-0

DO - 10.1007/s13391-013-3027-0

M3 - Article

VL - 9

SP - 669

EP - 676

JO - Electronic Materials Letters

JF - Electronic Materials Letters

SN - 1738-8090

IS - 5

ER -