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Inkjet printed nano-particle Cu process for fabrication of re-distribution layers on silicon wafer

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review


Original languageEnglish
Title of host publication2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 27-30 May 2014, Orlando, FL
PublisherInstitute of Electrical and Electronics Engineers IEEE
Number of pages5
ISBN (Print)978-1-4799-2407-3
Publication statusPublished - 2014
Publication typeA4 Article in a conference publication
EventElectronic Components and Technology Conference -
Duration: 1 Jan 2014 → …


ConferenceElectronic Components and Technology Conference
Period1/01/14 → …