Tampere University of Technology

TUTCRIS Research Portal

Inkjet printed nano-particle Cu process for fabrication of re-distribution layers on silicon wafer

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Details

Original languageEnglish
Title of host publication2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 27-30 May 2014, Orlando, FL
PublisherInstitute of Electrical and Electronics Engineers IEEE
Pages1685-1689
Number of pages5
ISBN (Print)978-1-4799-2407-3
DOIs
Publication statusPublished - 2014
Publication typeA4 Article in a conference publication
EventElectronic Components and Technology Conference -
Duration: 1 Jan 2014 → …

Conference

ConferenceElectronic Components and Technology Conference
Period1/01/14 → …