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Inkjet printed single layer high-density circuitry for a MEMS device

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Details

Original languageEnglish
Title of host publication2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
PublisherIEEE
Pages968-972
Number of pages5
ISBN (Print)9781479986095
DOIs
Publication statusPublished - 15 Jul 2015
Publication typeA4 Article in a conference publication
EventIEEE Electronic Components and Technology Conference - , United States
Duration: 1 Jan 2000 → …

Conference

ConferenceIEEE Electronic Components and Technology Conference
CountryUnited States
Period1/01/00 → …

Abstract

For example high-density redistribution layers (RDL) require narrow conductor width and low enough resistance. We have studied the applicability of an additive electrodynamic inkjet printer, Super Inkjet (SIJ), as a potential replacement for the current non-additive manufacturing method used in circuitry fabrication for MEMS devices. This was done by examining the topography of the printed lines and relating this to the resistance. For example five and two micron wide conductors were demonstrated with aspect ratio as high as 0,8 and 0,9. The average resistivity value for the five micron wide conductors was 17 μOhm·cm and 15 μOhm·cm for the two micron case. Also the repeatability of the line width calibration process was evaluated. The accuracy was found to be approximately one micron.