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Inkjet printing of radio frequency electronics: Design methodologies and application of novel nanotechnologies

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Inkjet printing of radio frequency electronics : Design methodologies and application of novel nanotechnologies. / Le, Taoran; Lin, Ziyin; Vyas, Rushi; Lakafosis, Vasileios; Yang, Li; Traille, Anya; Tentzeris, Manos M.; Wong, Ching Ping.

In: Journal of Electronic Packaging, Vol. 135, No. 1, 011007, 2013.

Research output: Contribution to journalArticleScientificpeer-review

Harvard

Le, T, Lin, Z, Vyas, R, Lakafosis, V, Yang, L, Traille, A, Tentzeris, MM & Wong, CP 2013, 'Inkjet printing of radio frequency electronics: Design methodologies and application of novel nanotechnologies', Journal of Electronic Packaging, vol. 135, no. 1, 011007. https://doi.org/10.1115/1.4023671

APA

Le, T., Lin, Z., Vyas, R., Lakafosis, V., Yang, L., Traille, A., ... Wong, C. P. (2013). Inkjet printing of radio frequency electronics: Design methodologies and application of novel nanotechnologies. Journal of Electronic Packaging, 135(1), [011007]. https://doi.org/10.1115/1.4023671

Vancouver

Le T, Lin Z, Vyas R, Lakafosis V, Yang L, Traille A et al. Inkjet printing of radio frequency electronics: Design methodologies and application of novel nanotechnologies. Journal of Electronic Packaging. 2013;135(1). 011007. https://doi.org/10.1115/1.4023671

Author

Le, Taoran ; Lin, Ziyin ; Vyas, Rushi ; Lakafosis, Vasileios ; Yang, Li ; Traille, Anya ; Tentzeris, Manos M. ; Wong, Ching Ping. / Inkjet printing of radio frequency electronics : Design methodologies and application of novel nanotechnologies. In: Journal of Electronic Packaging. 2013 ; Vol. 135, No. 1.

Bibtex - Download

@article{19efb83a61944b4589cc8aa98956acc5,
title = "Inkjet printing of radio frequency electronics: Design methodologies and application of novel nanotechnologies",
abstract = "We discuss here the use of inkjet printing technology as an attractive alternative for the fabrication of radio frequency (RF) electronics. Inkjet printing is compared to widelyused traditional methods such as wet etching and mechanical milling with discussion of the advantages and potential disadvantages afforded by the technology. Next the paper presents the current state of the art for RF printed electronics, including fundamental fabrication technologies, methodologies, and materials. Included are detailed discussions of the fabrication of foundational conductive elements, integration of external elements via low temperature bonding techniques, and enhancement strategies focusing on the addition of novel materials. We then present some current challenges related to inkjet printing, along with some exciting recent advances in materials technology seeking to overcome the current limitations and to expand the frontier of the technology. Following are multiple examples detailing the successful use of inkjet printing methods in the creation of novel RF devices, providing proof of concept and illustrating in greater detail the concepts presented in the theoretical sections.",
keywords = "Annealing, CNT, Conductive silver ink, Direct write, Electrical design, Flexible circuits, Graphene, Inkjet-printed electronics, Low temperature bonding, Microwave, Organic electronics, Paper-based electronics, Sensors, SOP",
author = "Taoran Le and Ziyin Lin and Rushi Vyas and Vasileios Lakafosis and Li Yang and Anya Traille and Tentzeris, {Manos M.} and Wong, {Ching Ping}",
year = "2013",
doi = "10.1115/1.4023671",
language = "English",
volume = "135",
journal = "Journal of Electronic Packaging",
issn = "1043-7398",
publisher = "American Society of Mechanical Engineers",
number = "1",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Inkjet printing of radio frequency electronics

T2 - Design methodologies and application of novel nanotechnologies

AU - Le, Taoran

AU - Lin, Ziyin

AU - Vyas, Rushi

AU - Lakafosis, Vasileios

AU - Yang, Li

AU - Traille, Anya

AU - Tentzeris, Manos M.

AU - Wong, Ching Ping

PY - 2013

Y1 - 2013

N2 - We discuss here the use of inkjet printing technology as an attractive alternative for the fabrication of radio frequency (RF) electronics. Inkjet printing is compared to widelyused traditional methods such as wet etching and mechanical milling with discussion of the advantages and potential disadvantages afforded by the technology. Next the paper presents the current state of the art for RF printed electronics, including fundamental fabrication technologies, methodologies, and materials. Included are detailed discussions of the fabrication of foundational conductive elements, integration of external elements via low temperature bonding techniques, and enhancement strategies focusing on the addition of novel materials. We then present some current challenges related to inkjet printing, along with some exciting recent advances in materials technology seeking to overcome the current limitations and to expand the frontier of the technology. Following are multiple examples detailing the successful use of inkjet printing methods in the creation of novel RF devices, providing proof of concept and illustrating in greater detail the concepts presented in the theoretical sections.

AB - We discuss here the use of inkjet printing technology as an attractive alternative for the fabrication of radio frequency (RF) electronics. Inkjet printing is compared to widelyused traditional methods such as wet etching and mechanical milling with discussion of the advantages and potential disadvantages afforded by the technology. Next the paper presents the current state of the art for RF printed electronics, including fundamental fabrication technologies, methodologies, and materials. Included are detailed discussions of the fabrication of foundational conductive elements, integration of external elements via low temperature bonding techniques, and enhancement strategies focusing on the addition of novel materials. We then present some current challenges related to inkjet printing, along with some exciting recent advances in materials technology seeking to overcome the current limitations and to expand the frontier of the technology. Following are multiple examples detailing the successful use of inkjet printing methods in the creation of novel RF devices, providing proof of concept and illustrating in greater detail the concepts presented in the theoretical sections.

KW - Annealing

KW - CNT

KW - Conductive silver ink

KW - Direct write

KW - Electrical design

KW - Flexible circuits

KW - Graphene

KW - Inkjet-printed electronics

KW - Low temperature bonding

KW - Microwave

KW - Organic electronics

KW - Paper-based electronics

KW - Sensors

KW - SOP

UR - http://www.scopus.com/inward/record.url?scp=84878547011&partnerID=8YFLogxK

U2 - 10.1115/1.4023671

DO - 10.1115/1.4023671

M3 - Article

VL - 135

JO - Journal of Electronic Packaging

JF - Journal of Electronic Packaging

SN - 1043-7398

IS - 1

M1 - 011007

ER -