Integrating Printed and Silicon Electronics
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Professional
|Title of host publication||International Conference on Flexible and Printed Electroncis|
|Place of Publication||Yonezawa, Japan|
|Publication status||Published - Sep 2016|
|Publication type||D3 Professional conference proceedings|
To incorporate low-power high-performance computing into the SioDs, it is necessary to integrate both flexible printed and silicon components. This presentation focuses on the integration of printed and conventional electronics. It will present progress in 1) SMD mounting, 2) flip-chip bonding, and 3) direct chip connections (e.g. replacement of wire-bonding).