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Laser sintering of copper nanoparticles on top of silicon substrates

Research output: Contribution to journalArticleScientificpeer-review


Original languageEnglish
Article number035203
Number of pages5
Issue number3
Publication statusPublished - 9 Dec 2015
Publication typeA1 Journal article-refereed


This study examines the sintering of inkjet printed nanoparticle copper ink in a room environment using a laser as a high speed sintering method. Printed patterns were sintered with increasing laser scanning speed up to 400 mm s−1. The resistivities of the sintered structures were measured and plotted against the scanning speeds. Increased resistivity seems to correlate with increased scanning speed. A selections of analytical methods was used to study the differences in microstructure and composition of the sintered structures. Based on the results, no discernable difference in the microstructure was noticed between the structures sintered using 20 mm s−1 to 400 mm s−1 scanning speeds; only the structure scanned using 5 mm s−1 speed showed a vastly different microstructure and no resistivity was measurable on this structure. Compositional studies revealed that, apart from the structure scanned with 5 mm s−1 speed which contained the highest oxygen, the rest of the structures showed a steady oxygen increase with increased scanning speed.

ASJC Scopus subject areas


  • inkjet , sintering, Resistance, Nanoparticles

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