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Materials for electronics by thermal spraying

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Details

Original languageEnglish
Title of host publicationPhysical and Numerical Simulation of Materials Processing VII
Pages451-456
Number of pages6
Volume762
DOIs
Publication statusPublished - 2013
Publication typeA4 Article in a conference publication
Event7th International Conference on Physical and Numerical Simulation of Materials Processing, ICPNS 2013 - Oulu, Finland
Duration: 16 Jun 201319 Jun 2013

Publication series

NameMaterials Science Forum
Volume762
ISSN (Print)02555476

Conference

Conference7th International Conference on Physical and Numerical Simulation of Materials Processing, ICPNS 2013
CountryFinland
CityOulu
Period16/06/1319/06/13

Abstract

In this paper, dielectric and conductive properties of thermally sprayed Al2O3- and Cubased coatings on steel and alumina substrates were studied. Alumina powders with nano- and micro-sized additions of Ni, NiO, TiO2, silica, and commercial glass were used in High Velocity Oxygen Fuel (HVOF) deposition. The conventional commercial copper powder and three Ag, WC and H2 -modified powders were used in Direct Write Thermal Spray (DWTS) deposition. Mixed phases of α-Al2O3 and γ-Al2O3 were found to be present in the as-deposited coatings. Sprayed alumina-based composites exhibited dielectric permittivity of 5.3-13.9 and losses of 0.002-0.178 at 1 MHz and 1 GHz while the additions tend to increase the values. Sprayed compositions with glasstype additions were found to retain α-Al2O3 crystalline phase after the deposition. Cu depositions, especially modified ones, realised by Direct Write Thermal Spray (DWTS) showed conductivity values as high as 42-56% of IACS values. The results demonstrate that ceramic and conductive coatings fabricated by thermal spray techniques show feasible properties for electrical applications, such as low-frequency components and insulation layers to be utilised in embedded 3D circuitry, in a way that is not possible through traditional manufacturing methods.

Keywords

  • Conductivity, Dielectric properties, Direct write thermal spray, HVOF, Thermal spraying