Molecular Dynamics Study of Thermally Induced Shear Strain in Nanoscale Copper
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific
Details
Original language | English |
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Title of host publication | 1999 International Conference on Modeling and Simulation of Microsystems MSM99, April 19-21, 1999, San Juan Marriot, San Juan, Puerto Rico, USA |
Place of Publication | San Juan, USA |
Pages | 475-478 |
Publication status | Published - 1999 |
Publication type | B3 Non-refereed article in conference proceedings |