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Molecular Dynamics Study of Thermally Induced Shear Strain in Nanoscale Copper

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

Details

Original languageEnglish
Title of host publication1999 International Conference on Modeling and Simulation of Microsystems MSM99, April 19-21, 1999, San Juan Marriot, San Juan, Puerto Rico, USA
Place of PublicationSan Juan, USA
Pages475-478
Publication statusPublished - 1999
Publication typeB3 Non-refereed article in conference proceedings

Publication forum classification