Novel approach on application manufacturing using inkjet printing, laser ablation and new polymer substrate
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific
Details
| Original language | English |
|---|---|
| Title of host publication | ICEP2010. International Conference on Electronics Packaging, May 12-14, 2010, Hokkaido, Japan |
| Pages | 249-254 |
| Publication status | Published - 2010 |
| Publication type | B3 Non-refereed article in conference proceedings |