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Novel approach on application manufacturing using inkjet printing, laser ablation and new polymer substrate

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

Details

Original languageEnglish
Title of host publicationICEP2010. International Conference on Electronics Packaging, May 12-14, 2010, Hokkaido, Japan
Pages249-254
Publication statusPublished - 2010
Publication typeB3 Non-refereed article in conference proceedings