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Novel glass welding technique for hermetic encapsulation

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Details

Original languageEnglish
Title of host publication5th Electronics System-Integration Technology Conference, ESTC 2014, September 16-18, 2014, Helsinki, Finland
Place of PublicationPiscataway, NJ
PublisherInstitute of Electrical and Electronics Engineers IEEE
Pages1-4
Number of pages4
ISBN (Print)978-147994026-4
DOIs
Publication statusPublished - 2014
Publication typeA4 Article in a conference publication

Publication forum classification

Field of science, Statistics Finland