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Novel glass welding technique for hermetic encapsulation

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Novel glass welding technique for hermetic encapsulation. / Lundén, Heidi; Kumpulainen, Tero; Määttänen, Antti; Vihinen, Jorma.

5th Electronics System-Integration Technology Conference, ESTC 2014, September 16-18, 2014, Helsinki, Finland. Piscataway, NJ : Institute of Electrical and Electronics Engineers IEEE, 2014. p. 1-4.

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Harvard

Lundén, H, Kumpulainen, T, Määttänen, A & Vihinen, J 2014, Novel glass welding technique for hermetic encapsulation. in 5th Electronics System-Integration Technology Conference, ESTC 2014, September 16-18, 2014, Helsinki, Finland. Institute of Electrical and Electronics Engineers IEEE, Piscataway, NJ, pp. 1-4. https://doi.org/10.1109/ESTC.2014.6962719

APA

Lundén, H., Kumpulainen, T., Määttänen, A., & Vihinen, J. (2014). Novel glass welding technique for hermetic encapsulation. In 5th Electronics System-Integration Technology Conference, ESTC 2014, September 16-18, 2014, Helsinki, Finland (pp. 1-4). Piscataway, NJ: Institute of Electrical and Electronics Engineers IEEE. https://doi.org/10.1109/ESTC.2014.6962719

Vancouver

Lundén H, Kumpulainen T, Määttänen A, Vihinen J. Novel glass welding technique for hermetic encapsulation. In 5th Electronics System-Integration Technology Conference, ESTC 2014, September 16-18, 2014, Helsinki, Finland. Piscataway, NJ: Institute of Electrical and Electronics Engineers IEEE. 2014. p. 1-4 https://doi.org/10.1109/ESTC.2014.6962719

Author

Lundén, Heidi ; Kumpulainen, Tero ; Määttänen, Antti ; Vihinen, Jorma. / Novel glass welding technique for hermetic encapsulation. 5th Electronics System-Integration Technology Conference, ESTC 2014, September 16-18, 2014, Helsinki, Finland. Piscataway, NJ : Institute of Electrical and Electronics Engineers IEEE, 2014. pp. 1-4

Bibtex - Download

@inproceedings{3f2a8c4cb3da4589bae6edfac842afe0,
title = "Novel glass welding technique for hermetic encapsulation",
author = "Heidi Lund{\'e}n and Tero Kumpulainen and Antti M{\"a}{\"a}tt{\"a}nen and Jorma Vihinen",
note = "Contribution: organisation=mei,FACT1=1<br/>Portfolio EDEND: 2015-01-23",
year = "2014",
doi = "10.1109/ESTC.2014.6962719",
language = "English",
isbn = "978-147994026-4",
pages = "1--4",
booktitle = "5th Electronics System-Integration Technology Conference, ESTC 2014, September 16-18, 2014, Helsinki, Finland",
publisher = "Institute of Electrical and Electronics Engineers IEEE",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - Novel glass welding technique for hermetic encapsulation

AU - Lundén, Heidi

AU - Kumpulainen, Tero

AU - Määttänen, Antti

AU - Vihinen, Jorma

N1 - Contribution: organisation=mei,FACT1=1<br/>Portfolio EDEND: 2015-01-23

PY - 2014

Y1 - 2014

U2 - 10.1109/ESTC.2014.6962719

DO - 10.1109/ESTC.2014.6962719

M3 - Conference contribution

SN - 978-147994026-4

SP - 1

EP - 4

BT - 5th Electronics System-Integration Technology Conference, ESTC 2014, September 16-18, 2014, Helsinki, Finland

PB - Institute of Electrical and Electronics Engineers IEEE

CY - Piscataway, NJ

ER -