Performance of Anisotropically Conductive Adhesive Attachments on Adhesiveless Polyimide Substrate during High-Temperature Storage Tests
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Details
| Original language | English |
|---|---|
| Pages (from-to) | 3459-3464 |
| Number of pages | 6 |
| Journal | MRS Advances |
| Volume | 1 |
| Issue number | 51 |
| Early online date | 13 Jun 2016 |
| DOIs | |
| Publication status | Published - 2016 |
| Publication type | A1 Journal article-refereed |
Abstract
The high-temperature performance of electronics packages was studied at 180°C, 200°C and 240°C for 3,000h. The structure tested consisted of a fairly large silicon chip attached with anisotropic conductive adhesive (ACA) onto an adhesiveless PI substrate. These structures showed good electrical reliability at 180°C. Several early failures were seen at the other temperatures. However, only 23% of the test samples failed at 200°C, while considerably more failures were seen at 240°C. The results showed that good high-temperature reliability can be achieved with polymer interconnections. However, the exposure time should be limited, especially at very high temperatures, to avoid failures caused by the materials becoming brittle.