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Performance of Anisotropically Conductive Adhesive Attachments on Adhesiveless Polyimide Substrate during High-Temperature Storage Tests

Research output: Contribution to journalArticleScientificpeer-review


Original languageEnglish
Pages (from-to)3459-3464
Number of pages6
JournalMRS Advances
Issue number51
Early online date13 Jun 2016
Publication statusPublished - 2016
Publication typeA1 Journal article-refereed


The high-temperature performance of electronics packages was studied at 180°C, 200°C and 240°C for 3,000h. The structure tested consisted of a fairly large silicon chip attached with anisotropic conductive adhesive (ACA) onto an adhesiveless PI substrate. These structures showed good electrical reliability at 180°C. Several early failures were seen at the other temperatures. However, only 23% of the test samples failed at 200°C, while considerably more failures were seen at 240°C. The results showed that good high-temperature reliability can be achieved with polymer interconnections. However, the exposure time should be limited, especially at very high temperatures, to avoid failures caused by the materials becoming brittle.