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Possibilities of Fabricating Copper-based RFID Tags with Photonic-sintered Inkjet Printing and Thermal Transfer Printing

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Details

Original languageEnglish
Pages (from-to)1828-1831
Number of pages4
JournalIEEE Antennas and Wireless Propagation Letters
Volume16
Early online date13 Mar 2017
DOIs
Publication statusPublished - 2017
Publication typeA1 Journal article-refereed

Abstract

This letter studies the possibilities of manufacturing copper-based passive UHF RFID tags using inkjet and thermal printing on two substrate materials, polyimide (Kapton) and a polyester based substrate (Flexcon THERMLfilm). Both printing methods are tested to fabricate different tag designs, and the performance of successfully printed tags is evaluated using wireless measurements. Measurement results show that both the printing methods, while using copper material, can be used to effectively fabricate passive UHF RFID tag antennas on selected substrates.

Keywords

  • inkjet printing, Kapton, Photonic sintering, RFID, Thermal printing

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